Electronics Forum: stretch ipc 2

High-Temperature Solder Paste/wire: Sn05Pb93Ag02B

Electronics Forum | Tue May 28 17:50:20 EDT 2002 | myu

Hi, Everybody! I'm looking for a High-Temperature Solder Paste / wire: "Pb93WROL140.71454";or "00Z890"; J-STD-006 Solder Alloys Sn05Pb93Ag02B Sn% Pb% Ag% Solid C Liq C Solid F Liq F 5.0 92.5 2.5 280 284 536 543 It should meet IPC/J-ST

soft gold vs immersion gold

Electronics Forum | Mon Aug 16 13:18:46 EDT 2004 | davef

You bet our reponse changes. Q2R: Hard gold thickness is 4 to 10 u" for Au and 300 to 400 u" for nickel A2R: This is a hard gold spec?? It looks like a ENIG spec. Although, the Ni is quite heavy, 150 uin is sufficient for most applications. The gol

Pre-bake times and temperature for polyimide boards

Electronics Forum | Wed Jan 12 10:05:20 EST 2005 | Dreamsniper

we are using polyimide boards 6 inches x 7 inches, 2.5mm thick, 12 to 14 layers, for aerospace industries. I am using a long bake of 12 hours at 70'C prior to manufacturing or exposure to elevated reflow and wave soldering temperature. If schedule i

IPC-A-610D Question

Electronics Forum | Tue May 02 14:56:57 EDT 2006 | Tim

8.2.5.5 Flat Ribbon, L, and Gull Wing Leads, Maximum Heel Fillet Height (E). For class 3 the heel fillet cannot touch the body of a plastic component, except for SOICs and SOTs. Why is my question? What type of failure will be the result of solder

What is 'toe down configuration' 8.2.5.6 IPC-A-610D?

Electronics Forum | Thu Apr 12 00:25:25 EDT 2007 | raychamp007

Thanks davef! We found some SOIC & QFP with all leads having toe down problem. The heel fillet unable extend to the mid point outside bend. Do you have solutions for the problem? I have a question: How about the normal gull wing lead which is flat &

ENIG

Electronics Forum | Wed Jan 21 04:14:19 EST 2009 | sachu_70

Hi Adam, I would suggest you refer IPC-2221 guidelines which define plating thickness as: Nickel 2.5-5.0 um , Gold 0.08-0.23 um. Although ENIG is a standard process, there is an associated risk towards Gold embrittlement, Porous Gold, or Black pad de

Modems reflow mistake

Electronics Forum | Mon Oct 12 15:51:47 EDT 2015 | davef

IPC-A-610E-2010, Acceptability of Electronic Assemblies, 8.3.4 Castellated Terminations talks to the acceptability of solder connections on components like yours. It’s tough to say from the pictures, but I’d say your issues are: Missing solder: Plat

QFN welding problem by reflux oven 10 zones

Electronics Forum | Tue Feb 11 12:59:06 EST 2020 | astarotf

Hi Steve Thomas Effectively by IPC-610 standard specifies in the "content 8.2.13 Quad Flat Pack Plastic Package - Without Terminals (PQFN), Table 8-13, page 8-84" which depending on the class of manufacture notes 2-5 of the table, which in theory do

Re: IP3 Fiducials.. How Many should I read?

Electronics Forum | Thu Dec 24 11:09:26 EST 1998 | Earl Moon

| | Okay here is the deal. I am fairly new to the company here, but one thing I have noticed is that we read way to many fiducials, in my opinon anyway. One for example is this. One assembly was reading 17 fids. Smallest pitch was .25mil I say y

Contract Manufacturer's warranty policy

Electronics Forum | Wed Mar 21 09:31:39 EST 2001 | CAL

Susan - Thank you for providing more information. It is hard just to give a rule of thumb on warranty time. Comparing other contract manufactures is also misleading. I have seen 30 days to 10 year warranties from contract manufacturers. Here are some


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