Electronics Forum | Wed Jun 12 08:24:03 EDT 2002 | davef
Tough. 0402 capacitors are more prone to tomb stoning than resistors. Tailor your process to the 0402 and let the other stuff fall where it falls. Search the fine SMTnet archives for discussion on tomb stoning. Consider: * Changing paste. * Apply
Electronics Forum | Thu Mar 01 12:08:33 EST 2007 | rob_thomas
It sounds like something is a little off here. ROHS compatible and ROHS capable parts are going to be ok with a leaded solder paste and processing unless you are building high reliability product.( some are going to argue that even high rel products
Electronics Forum | Tue May 29 09:36:24 EDT 2007 | davef
oxygen sensor instrumentation Amoung the oxygen monitor suppliers that tailor themselves to reflow machines are: * MapCheck 9000 Process Oxygen Monitor [Topac; 231 CJC Hwy, Suite 103 Cohasset MA 02025; 781-740-8778 F781-740-8779 topac.com sales@topa
Electronics Forum | Thu Apr 14 13:24:18 EDT 2016 | davef
I doubt that your problem is driven primarily by irregularities in your circuit board. My bet is that you’re seeing defects caused primarily by the warpage in your LGA. Consider using advice often given for minimizing warpage caused defects in BGA
Electronics Forum | Fri Sep 07 11:46:29 EDT 2018 | dleeper
Air gap on the PCB is determined the pad spacing which in turn is governed by the component. As long as the PCB designer is following the typical BGA layout best practices; i.e no open via in pad, non-solder mask defined pads, solder mask covered tra
Electronics Forum | Fri Apr 29 23:57:24 EDT 2022 | auriga2001
I ran a SMT production line with and without SPI. I was also charged with gathering the time and defect metrics when we got our new SPI machine, comparing before and after implementation. It saved time on the printer because it didn't have to handle
Electronics Forum | Tue Apr 03 22:03:18 EDT 2001 | davef
With friends like you, who needs enemies? I�d guess that the perceived benefits of flat pads for your 20 mil pitch and below components counter-balance the higher cost, gold being a solder pot contaminant, limited solder mask compatibility, potentia
Electronics Forum | Fri May 15 09:07:12 EDT 1998 | Earl Moon
| | I hear that there is a problem with using ceramic parts that are sizeable. Apparently, there is a mismatch in the Temperature Coefficient of Expansion between the FR4 and ceramic materials which causes the soldered erminations to weaken and event
Electronics Forum | Fri Mar 06 10:15:00 EST 1998 | Justin Medernach
| Does anyone know of a web page that provides troubleshooting techniques for the printing process? We aren't experiencing a problem right know but are attempting to set up a reference guide for training. Any help would be greatly appreciated. | Than
Electronics Forum | Wed Jul 31 17:37:46 EDT 2002 | davef
We are not very smart about this. We base our machine PM on manufacturer�s recommendations. In real life, those recommendations are fairly conservative for a new a machine and probably need to be tailored for a more mature machine. The buzzword
