Electronics Forum | Thu Apr 19 16:54:32 EDT 2007 | flipit
I don't suggest using Pd/Ag or Ag/Pd terminated components unless you are forced to use them. You often see a line of demarcation that suggests a poorly wetted solder joint. I have had bad experiences with Pd/Ag terminated capacitors. Even when so
Electronics Forum | Wed Aug 29 11:07:39 EDT 2007 | mikecollier
I am being asked to perform the same evaluation now with a Au/Pd termination varistor. We currently use a Pb/Sn process with an RMA flux. The manufacturer of the device recommends going to a 2% silver paste. What is the intended advantage with 2%
Electronics Forum | Wed Apr 04 04:26:08 EDT 2007 | AR
Pavel, We had exactly the same kind of problem with exactly the same type of component. Our components were well within their best before -date so it is not question of that. As we could not get it to work we changed to nickel barrier finish on the
Electronics Forum | Wed Apr 04 03:07:16 EDT 2007 | pavel_murtishev
Good morning, Problem definition Poor soldering of thermistors with Ag/Pd termination Background Process: lead free reflow soldering Paste type: Multicore LF300, SAC305 Component type: 0805 chip thermistor, Ag/Pd termination PWB finish: immersion A
Electronics Forum | Fri Oct 17 15:23:28 EDT 2014 | davef
First, don't exceed the maximum temperature of the battery, say 85*C [I don't know your specifics] Second, don't short the terminals of the battery. Third, the best way to wave solder a battery is: * Insert an insulating tab between the battery an
Electronics Forum | Wed Apr 21 00:14:10 EDT 2004 | ramanandkini
We wish to use rectangular 4 segment solar panels in our quartz watches & charge the battery. The size of the soalr panel is 18.20mm X 7 mm and the thickness is 1.15mm. The other popular application of this type solar panels is in calculators. These
Electronics Forum | Thu Aug 29 20:01:23 EDT 2002 | davef
Many people use the same spacing [and pad designs] as they use for primary side SMT. We don�t. DOWN STREAM SMT-TO-SMT SPACING: In addition to proper orientation, components cannot be immediately upstream of terminations that are to be soldered or b
Electronics Forum | Thu Sep 09 05:23:10 EDT 2010 | 15009
You can reduce and almost eliminate voids and other paste related defects in LGA's BGA's, QFN's etc, by using solid solder deposit. Its been around for 24 years, 13 in the US. It is now included in the new IPC 7093 specification for bottom terminat
Electronics Forum | Fri Aug 08 09:49:17 EDT 2008 | scottp
We've seen the exact same problem. The solder joints had negative wetting angles and x-sections show that the PdAg termination dissolved into the solder. We no longer allow PdAg terminations.
Electronics Forum | Sun Aug 10 03:39:21 EDT 2008 | eyalg
Thanks Pete yes we usu ROHS solder paste in our process. I agree that this termination is more suitable for adhsive bonding rather than soldering. We'll try changing the termination type as you recommended. Eyal G
