Electronics Forum | Mon Mar 24 12:11:11 EDT 2008 | jdumont
Thats the one I found while researching this AM also. Thanks for the assist. Any ideas if this can be process related? Im sure it can be but its odd that it only happens on one vendors board. I think because it is an 10 layer board that maybe they ha
Electronics Forum | Mon Mar 24 22:53:22 EDT 2008 | davef
As you say, just about defect can be tied to process, one way or another. If you want to think about it, search the fine SMTnet Archives for background on barrel cracking. Other things are: * How thick is the actual via plating from the two supplier
Electronics Forum | Wed Mar 26 09:19:20 EDT 2008 | nibirta
hi all...well i`m working in such a lab but we are working internally, and for our customers. But i can give you some prices from other labs. Cross section-one location is around: Solder Joint Integrity Std. sample plastic package $300.00 Shorts /
Electronics Forum | Wed Nov 12 20:24:45 EST 2003 | Henry
Anyone who has experience in IPC-TM-650 Environment test Method 2.6.3.1? I have a question. It is the procedure to finish electrical connections. According to 2.6.3.1D, there are apparatus which are solder pot, soldering iron and flux. Then solder a
Electronics Forum | Mon Mar 24 09:09:40 EDT 2008 | jdumont
Hello all, we have been seeing a lot of issues with broken or open vias on a couple of our bare boards. We have two vendors make these for us and the issue is only with one vendors boards. We have stopped using them until we can figure out what is go
Electronics Forum | Tue Mar 25 07:33:46 EDT 2008 | davef
References [Analog Devices] 1) "Surface Preparation and Microscopy of Materials" B Bousfield, John Wiley & Sons, LTD., West Susse_, England, 1992 2) "Metallography Principles and Procedures" Leco, Corp. 1992 3) "Buehler Dialog, Microstructural Analys
Electronics Forum | Fri Mar 30 13:06:50 EST 2001 | aortiz
Hi, I need support on the method or applicable standard to measure the shear force strength on chip capacitors and resistors. I know the soldered joints strength is related to land desing, solder volume, pcb and component solderability, component
Electronics Forum | Wed Sep 12 18:11:03 EDT 2001 | davef
First, what on the area array package are you analyzing � * Package cracking? * Cracked solder balls? * Er, what? Second, most failure analysis discussions consider dye penetration to be a non-destructive test, but then again most failure analysis
Electronics Forum | Wed Nov 16 03:41:43 EST 2016 | Haizen
I need to extract data from a log file and sort the data in an Excel file. Details are as follows: - Log File is a measurement result produced by an In-Circuit Tester (no info. about it, no name, no type, nothing). - Measurement Result is from
Electronics Forum | Fri Jun 16 11:37:15 EDT 2006 | docker
I�m working in Solder paste manufacturing industry and my customer has complained the void issue on BGA pad. I�m internally conducting the void test on BGA pad in my Lab. I used OSP furnish board with Sn/Pb and /or lead free component using Lead free