Electronics Forum | Thu May 28 08:56:12 EDT 1998 | Earl Moon
| I have a component that is glue cured on the bottom of a pcb. The component is a 1206 size jumper. It is made up of iron/nickel alloy. The problem I am having is that the part will fall off the board during wave solder. Is the component not abl
Electronics Forum | Tue Nov 07 08:01:10 EST 2006 | davef
We/ve never heard of "glass wicking failure" in regards to board fab. Boat fab, yes. Look here: http://www.boatdesign.net/forums/showthread.php?t=13321 Barrel cracking appears after thermal stress during soldering, because epoxy expands in the "z"
Electronics Forum | Sun Aug 23 11:30:51 EDT 2009 | ysutariya
I think you're getting steered in the wrong direction, with the exception of DaveF's link. By the way, I'm a PCB fabricator, just to avoid any backlash. IPC 4101 is the IPC guideline for raw materials. It has 6 slash sheets for lead-free capable
Electronics Forum | Fri Jun 26 11:27:12 EDT 1998 | Earl Moon
| | Alright gentlemen and ladies of the forum, I again seek knowlage on what is probably a well known fact. I have spent a good part of the morning with various IPC standards and weighty tomes such as the Electronic Packaging and Interconnection Han
Electronics Forum | Fri Jun 26 15:37:50 EDT 1998 | Justin Medernach
| | | Alright gentlemen and ladies of the forum, I again seek knowlage on what is probably a well known fact. I have spent a good part of the morning with various IPC standards and weighty tomes such as the Electronic Packaging and Interconnection H
Electronics Forum | Mon Jun 13 07:20:10 EDT 2011 | scottp
It's more likely the warp is due to material issues. I've spent way more time than I'd care to admit running Thermoire with various profiles and there's pretty much nothing you can do to reduce warp via profile unless your current profile is truly a
Electronics Forum | Wed Sep 02 08:52:13 EDT 1998 | Justin Medernach
| | We are experiencing shorting on a BGA. The part has a 1mm pitch with a 196 I/O count. The problem seems to pop up without warning & disappear in the same manner. | | Our pad design is .020" diameter pads with .025" solder resist diameter. Th
Electronics Forum | Wed Apr 05 22:31:51 EDT 2000 | Dave F
Robert: Out of curiosity, by "BT" do you mean: � Bismaleimide triazine, the stuff used to increase the tg of resins used in some BGA interposers. � British Telecommunications plc, the guys with bad teeth. � BrookTree, the RAMDAC supplier, that�s par
Electronics Forum | Thu Feb 03 21:17:07 EST 2000 | Dave F
AF: Unfortunately, there is no "acceptable number of cycles" either in air-to-air and one liquid-liquid thermocycling, nor interconnect stress testing. There can be a "minimum threshold" that would assure no failures as the result of the assembly p
Electronics Forum | Sun Aug 08 20:59:55 EDT 1999 | Dreamsniper
| | | What oven temperature should be used to reflow solder (Sn63Pb37) on a PC board (0.075" to 0.100" thickness) in 5 to 10 minutes? | | | | Profiling - tedious but important. As said, start with the paste manufacturers recomendation which is usua
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