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Is Stress the Root of Tin Whisker Growth? Brown University professor and other experts to present research at 7th International Tin Whiskers Symposium

Industry News | 2013-11-01 16:09:44.0

Eric Chason, Ph.D., professor of engineering at Brown University, will present his tin whisker research at the 7th International Tin Whiskers Symposium, November 12–13 in Costa Mesa, Calif., hosted by IPC with academic partner CALCE.

Association Connecting Electronics Industries (IPC)

IPC Solder Products Value Council White Paper Simplifies Comparison of Lead-free Alloys

Industry News | 2014-08-18 10:23:40.0

The IPC Solder Products Value Council (SPVC), in cooperation with iNEMI, has written a white paper, Analytical Procedures for Portable Lead-Free Alloy Test Data, that helps users determine which alloy characteristics best match their requirements.

Association Connecting Electronics Industries (IPC)

SMTA China Presents Nine Best-Paper / Oustanding Paper / Best Presentation Awards and Two Best Exhibit Awards at SMTA China East 2016 Conference / Nepcon China 2016

Industry News | 2016-05-09 21:21:15.0

SMTA China announces that it presented awards for Nine papers at the SMTA China East 2016 Conference Award Presentation Ceremony, held on Tuesday, April 26, 2016 at Shanghai World Expo Exhibition & Convention Center in conjunction with the SMTA China Annual Award Ceremony.

Surface Mount Technology Association (SMTA)

IPC Delivers the First Automotive Standard on Performance Requirements for Rigid Printed Boards

Industry News | 2016-06-27 14:54:49.0

In September of 2015, IPC delivered revision D of IPC-6012, Qualification and Performance Specification for Rigid Printed Boards. Building on this base standard, IPC has developed the first automotive addendum, IPC-6012DA, Automotive Applications Addendum to IPC-6012D Qualification and Performance Specification for Rigid Printed Boards.

Association Connecting Electronics Industries (IPC)

Best Technical Paper at IPC APEX EXPO 2021 Selected

Industry News | 2021-02-25 13:34:06.0

The best technical conference paper of IPC APEX EXPO 2021 has been selected. Voted on through a ballot process by members of the IPC APEX EXPO Technical Program Committee, the paper authors will be recognized during show opening remarks on Tuesday, March 9.

Association Connecting Electronics Industries (IPC)

Seven IPC APEX EXPO™ Technical Conference Sessions Go Global - Live From Las Vegas

Industry News | 2011-01-20 13:45:14.0

IPC will introduce a cyber conference at IPC APEX EXPO in Las Vegas in 2011. The IPC APEX EXPO Cyber Conference will feature live broadcasts and post-show archives of seven of the show's thirty-five technical conference sessions on April 12–14, 2011.

Association Connecting Electronics Industries (IPC)

IPC Solder Products Value Council, Solectron, Flextronics and U.S. NAVSEA Begin Reliability Test Program on Lead-Free Solder

Industry News | 2003-06-11 08:00:48.0

IPC has begun a comprehensive study of the three leading lead-free alloys (Tin-Silver-Copper) in an effort to analyze the properties of the leading candidates for lead-free assembly.

Association Connecting Electronics Industries (IPC)

SMTA Europe's Harsh Environments Conference Session 6 to Focus on Automotive Electronics

Industry News | 2018-04-18 18:06:14.0

SMTA Europe announces Session 6 Technical Program on Automotive Electronics at the “Electronics in Harsh Environments Conference” to be held in Amsterdam, Netherlands, on April 25th, 2018.

Surface Mount Technology Association (SMTA)

Best Papers from SMTA International Announced

Industry News | 2024-02-05 14:05:05.0

The SMTA is pleased to announce the Best Papers from SMTA International 2023. The winners were selected by members of the conference technical committee. This year awards were given for the "Best of Proceedings" category but also for a new designation of "Best Practical and Applications-Based Knowledge." A plaque is given to primary authors of all winning papers for these exceptional achievements.

Surface Mount Technology Association (SMTA)

MPM Printer: EdgeLoc™ uses software-controlled pressure for optimal board holding force, automatically adapts to the programmed board thickness, and firmly holds the board without the use of top clamps for optimum accuracy and repeatability.

MPM Printer: EdgeLoc™ uses software-controlled pressure for optimal board holding force, automatically adapts to the programmed board thickness, and firmly holds the board without the use of top clamps for optimum accuracy and repeatability.

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MPM Printer: EdgeLoc™ uses software-controlled pressure for optimal board holding force, automatically adapts to the programmed board thickness, and firmly holds the board without the use of top clamps for optimum accuracy and repeatability.

ITW EAE


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