Electronics Forum | Mon May 14 16:36:58 EDT 2012 | davef
You're thinking correctly in trying to improve your process. Can you change to a more active flux? Look at the copper that connects to the center pin. You may need to relay-out the board to add a wagon wheel style thermal relief in that area.
Electronics Forum | Mon Sep 17 12:21:43 EDT 2018 | bpeay
M_, the parts may be similar but the boards look to be different. Is the thermal relief for each lead on each board the same? what is the board finish, HASL, Enig, OSP or other? The part itself may not be your problem but the part that is partial pla
Electronics Forum | Thu Mar 22 16:02:37 EST 2001 | dblsixes
In the end, we may have to go to our customer to see if we can get Class 3 relief ... We actually did an experiment by adding a ceramic cap to the top of the part, using a thermal paste to improve the thermal connection. It didn't do much for us ..
Electronics Forum | Fri Oct 11 09:28:14 EDT 2002 | davef
Designers love to do BIG copper pours for several reasons: * Maximize heat spreading. * Increase EMI shielding. * Laziness. The poor folk that solder the parts on boards HATE big copper planes near solder pads. During soldering, fat copper traces [
Electronics Forum | Thu Jun 04 09:25:21 EDT 1998 | Chrys
| | | Hello: | | | BACKGROUD: SMT components soldered on the top-side of boards that also require wave soldering have the potential to reflow during wave soldering. Reflowing these components during wave soldering is not good. It can cause cold jo
Electronics Forum | Thu Feb 10 09:08:21 EST 2000 | C.K.
We've got this hard-to-Wave-solder board where all of the SMD's are on a ground plane - in fact the entire bottom-side is a ground plane. Our designers have incorporated thermal relief on some of the pads, but for reasons unknown to us, they don't h
Electronics Forum | Wed Jun 03 13:51:57 EDT 1998 | Dave F
Hello: BACKGROUD: SMT components soldered on the top-side of boards that also require wave soldering have the potential to reflow during wave soldering. Reflowing these components during wave soldering is not good. It can cause cold joints, opens
Electronics Forum | Thu Jun 02 11:16:23 EDT 2005 | JH
I concern about the Through Hole soldering as well. Currently, we have encountered some problems of Multilayer from Through Hole soldering. The root-cause is probably related to PCB Finish, machine setting, Thermal relief Pad or hole and something e
Electronics Forum | Sat Jun 04 01:32:09 EDT 2005 | adlsmt
Has anyone tried to use electrically condctive adhesive rather than solder to connect the leads on 5 watt Luxeon parts? If you design the board right to dissipate heat, when you have a bunch of them in a tight array, even with thermal relief on the t
Electronics Forum | Tue Jun 03 12:29:58 EDT 2008 | slthomas
We don't build anything with BGA yet so don't have this standard but IPC-7095B, Design and Assembly Process Implementation for BGAs would be a good place to start. I don't know for a fact that it contains info. that applies specifically to your iss
