Electronics Forum | Mon Oct 08 23:17:48 EDT 2001 | Brad Arnold
We are trying to produce a PC Card bus assembly with a 672 pin BGA on one side. These pcb's are .015 thick. I believe the ball pitch is .5mm. The pcb's are plated with white tin. The pcb's are in a 1 X 3 array. We had 2 plates with appropriate cutout
Electronics Forum | Thu Oct 11 17:44:30 EDT 2001 | aaelect
OK, OK. 672 ball BGA. The pcbs are PC Card bus size and are .015 thick. There are 3 on a panel with about 1/2" between and rails. The aluminum plates are about 3" by 7". There are 3 cutouts which allow for the parts from either side to protrude du
Electronics Forum | Thu Oct 11 22:25:50 EDT 2001 | davef
Bruce I�m with yall. Designers and fabricators say �pins�. You say: * BGA pins are 1mm [0.039�] pitch. * BGA pads are 0.4mm [0.0157�] diameter. * BGA pins are 0.6 mm [0.024�] side-to-side. * Board thickness is ~0.4 mm [0.015�] First, as you can
Electronics Forum | Mon Jul 23 09:43:50 EDT 2007 | pjc
From NASA document: Conformal coating thickness shall be determined using a wet film thickness gauge,....... Wet Thickness Gauges can be obtained: Wet film Thickness Gauge P/N 790010 Nordson Corp, Amherst, OH or http://www.nordson.com/cgi-bin/MsmG
Electronics Forum | Sat Jan 08 06:46:33 EST 2022 | jineshjpr
Hi anyone knows what is the minimum copper foil thickness available across the industries to make PCB surface. Intention is to achieve 23 microns of finished copper thickness in a 0.3mm thickness PCB. Ideally if 3 microns plates are available, additi
Electronics Forum | Mon Aug 18 08:27:35 EDT 2003 | JAMES
Can anyone tell me how thick is too thick for panelization to be used. We have a board current that is 100 mils thick and I was told it can not be panelized. Could anyone tell me if this is true or not.
Electronics Forum | Sat Dec 10 07:03:59 EST 2005 | mdemos1
Hi. I am trying to find out the minimum copper thickness I should see on a through hole barrel. The board has 1 ounce copper and the board thickness is 0.062". I am finding thicknesses of 0.6 to 1.2 mils. Thanks, Mike.
Electronics Forum | Fri Feb 16 08:28:50 EST 2007 | pavel_murtishev
Good afternoon, Typical plating thickness for immersion tin is 0.6-1.0um. I do not know what the maximal thickness is. But plating is self-limiting process and I believe maximal thickness should be about 2-3um. BR, Pavel
Electronics Forum | Mon Jul 23 16:13:43 EDT 2007 | davef
It's it curious that NASA requires 'Thickness measurements shall be made with a wet film thickness gauge or equivalent tool' yet specifies 'cured thickness' as a measure. Why do you recon they do that?
Electronics Forum | Tue Jan 20 10:30:56 EST 2009 | milas
Hi We have just specified the following thicknesses for the Nickel and Gold on an ENIG finish board. The baord is to be manufactured using a lead - free process. My question: Is the thickness we've specificed likely to gie us any issues during manuf
.gif)
