Electronics Forum | Tue Mar 14 16:02:13 EST 2006 | russ
Wasn't trying to be funny. 90% of the time when I hear the wave is doing ???????? "we are sure that it is not like that before" I check and the parts are tilted or whatever before the wave. I had some more suggestions and ideas but..........
Electronics Forum | Mon Apr 03 06:56:34 EDT 2006 | jdumont
No problem if you get the tilt head option. Also depending on the geography you can just lift the nozzle up and the spray pattern will fan out more. The software is really good, i think you'll be impressed.
Electronics Forum | Thu Dec 07 18:13:13 EST 2006 | russ
Just had anopther thought, what type of parts are you using on this board? You may want to try a thin stencil like 5 mil or so this may help you. also can this "tilt" be from a movement during reflow? Russ
Electronics Forum | Thu Feb 08 14:15:45 EST 2007 | dwelch
Dave, I had the same problem in the past. Use fresh paste and a slightly higher profile. My guess is that you may not be completly reflowing. It worked for me. If that doesn't work you may want to check the bga itself, make sure balls are universal.
Electronics Forum | Fri Feb 09 08:45:31 EST 2007 | russ
Most likely either profile or I was thinking a cap! resistors are to thin to make the part stand up hehehe just a joke. Do not follow the advice of weighting part, that is ridiculous, poster of that, if you have never done BGA before please do not
Electronics Forum | Mon Feb 19 07:31:43 EST 2007 | jax
Check the nozzle. If these are the only two parts on the board that use a specific nozzle, it's a good place to start. The nozzle is probably not releasing well and shifting the component when trying to retract after placement...
Electronics Forum | Mon Feb 19 08:38:05 EST 2007 | realchunks
Are your pads on the board aligned correctly? I've seen this a lot lately. Pads on opposite sides are not aligned correctly. This causes the part to twist. If you have the Gerber and a way to check it, it's worth the 3 minutes to check.
Electronics Forum | Tue Feb 20 23:46:38 EST 2007 | Muhammad Haris
hi Jax the nozzle which i am using for these components are also used for large SOPs and other components so i cant blame my nozzles.The problem is, they always shift to some 5 degree plus but some times it place them accurately.
Electronics Forum | Tue Jan 26 18:23:33 EST 2010 | glennster
I agree that Dage makes some excellent 3D (CAT) systems, but in our experience a high-resolution 2D system with tilt capability is usually better-suited for inspection of solder joints. Glenn Robertson Process Sciences
Electronics Forum | Thu Feb 11 15:50:33 EST 2010 | glennster
Sergey, For a component OEM lab I agree that X-ray is probably the first priority, especially for process development and monitoring. Be sure to get a system with sample tilt and high resolution capability. When SAM is needed, a service provide
