Electronics Forum | Sat Mar 05 22:44:44 EST 2005 | gpaelmo
You can also try the Florida Circtech website or call them direct. There is a min. thickness requirement and if the board house does not follow it you will end up with scrap boards after the second pass (from experience). I even sent blank boards to
Electronics Forum | Tue Feb 27 20:24:11 EST 2001 | davef
Sorry for posting this whole thang but, I couldn't find it on Kester's site. Aw, just hit BACK ... ;-)
Electronics Forum | Tue Feb 07 13:39:42 EST 2006 | gregoryyork
You can use straight forward Tin/Copper but it flows very poorly so solderability is an issue. Dosing with Phos improves this but need to stay on top of it. We have supplied some 3.8%Ag alloys for flow they work well but you get a small 'chill point'
Electronics Forum | Sun Feb 05 09:29:12 EST 2006 | Cmiller
Look at: http://thor.inemi.org/webdownload/newsroom/Presentations/09.pdf Page 47 shows both alloys to be similar in reliability although its a little troublesome that the particular defects are not isolated as I feel there is a big difference betwee
Electronics Forum | Mon Feb 06 13:00:51 EST 2006 | amol_kane
Hi all, I just wave soldered 40 boards (20 if Imm Sn and 20 of Imm Ag) using SAC 305 (in this case the wave machine manufacturer (electrovert) suggested the alloy too). plan to carry out x-sectioning to see the results. overall, just from the visual
Electronics Forum | Wed Aug 05 07:46:46 EDT 1998 | Earl Moon
| We have mixed to negative feelings about Omikron, but I beileve it is due to problems with the board fabricator rather than the process itself. When done properly, our Omikron boards have had very good solderability. However, we have had several
Electronics Forum | Wed Feb 08 04:08:35 EST 2006 | fctassembly
Hello Greg, I agree with you that the article in SMT Magazine should be studied very carefully as it contains many errors in respect to SN100C. The testing performed was a DOE and was not an optimized run. There is also a statement on dross generatio
Electronics Forum | Fri Dec 16 08:16:41 EST 2005 | davef
Heat cycles deplete the pure tin layer. Each solder cycle reduces the tin thickness by ~0.1 micron (4 uin). So, if you start with a thin imm tin coating you'll have problems after multiple heat cycles. Steve Wentz says, "In almost every case I've
Electronics Forum | Wed Aug 30 19:59:45 EDT 2006 | davef
IPC-4554 - Specification for Immersion Tin Plating for Printed Circuit Boards
Electronics Forum | Tue Aug 31 12:01:26 EDT 2004 | russ
Kris, this practice has gone on for years. I have never heard of any problems associated with this. I have heard "grumblings" about tin lead parts being processed with lead free paste, but have seen or heard of no data to support. Russ
