Electronics Forum | Wed May 11 19:34:42 EDT 2005 | Tom B
You may want to check out Nihon Superior. Nihon licensed their Alloy to Aim for US production Late last month! The alloy uses nickel and the solder joints look amazing for "lead-free" they rival tin-lead in appearance. Other boasts is that you can
Electronics Forum | Wed Sep 16 09:25:26 EDT 2009 | clampron
Are you using a SAC305 or high tin alloy? That will corrode the solder tip as well. Chris
Electronics Forum | Wed Sep 16 09:58:23 EDT 2009 | geb
Its SAC305 paste. Will that corrode the tip or the tin alloy?
Electronics Forum | Fri Jan 20 08:55:31 EST 2006 | patrickbruneel
Steve, How do you measure the resistance is it by probing the surface? Concerning the alloy there is a straightforward linear correlation between the tin content and the electrical conductivity of the alloy. The higher the tin content in the alloy,
Electronics Forum | Mon Mar 07 15:35:35 EST 2005 | John M
It has been my experience that the standard Fr4 material (Tg 135c) will discolor when processed at the new higher temperatures required for the high tin alloys... We have been using the High Tg Fr4 (Tg 170c) for many years to ensure this does not hap
Electronics Forum | Wed Sep 27 23:52:28 EDT 2006 | fctassembly
Hello Steve, Yes, there are differences in the various alloys and I have described briefly below these differences: SN100- a common name for 100% tin that is used to increase the tin content in 63/37. SN100C-Name for Tin/Copper/Nickel/Germanium all
Electronics Forum | Tue Oct 11 14:42:15 EDT 2005 | patrickbruneel
NASA website on Tin whiskers: http://nepp.nasa.gov/whisker/ NEMI Tin whisker activities: http://www.inemi.org/cms/projects/ese/tin_whisker_activities.html CALCE Tin Whisker Working Group: http://www.calce.umd.edu/lead-free/tin-whiskers/ Measur
Electronics Forum | Fri Jul 08 09:49:06 EDT 2005 | fctassembly
Hello Lupo, Can you confirm the alloy you are using is the nickel stabilized tin/copper alloy. Thanks, Bob
Electronics Forum | Thu Jan 05 17:10:04 EST 2006 | russ
The CCGA packages that we install are still a tin/lead alloy and not a SAC alloy. They were 90/10 SN/PB. I beleive that this may be one reason why the difference.
Electronics Forum | Mon Mar 29 11:48:43 EDT 2010 | davef
SAC BGA In A Sn/Pb Reflow Process Conclusion: Area array components (ball grid arrays, chip scale packages, flip chip packages) with Pbfree solder sphere alloys should not be reflowed using a tin/lead reflow profile due to the resulting non-uniform s
