Electronics Forum: tm and flex (Page 4 of 7)

Cracking Capacitors and Solder Balls

Electronics Forum | Mon Jun 08 14:19:30 EDT 1998 | Gary Simbulan

Earl, et al, Boy things get old and cold around here fast. I promised more detail on my capactior problem and I thought I could drop something completely different in the same message and tell a tale of solder balls. First the caps. We still have

Fuji NP-133 and Universal Flex Jet

Electronics Forum | Wed Apr 14 22:23:09 EDT 1999 | wil allen

We are currently looking into purchasing either a Fuji NP or Universal Flex jet machine. Does anybody have any feedback from running these machines in a production environment? I now that a limited number of each machine has been released so far.

SMT on rig-flex and multi-flex boards

Electronics Forum | Fri Oct 22 11:53:53 EDT 2004 | C Lampron

Hi Christina, What would you be basing the yields off of? Is it solder defect, component placement, etc....? I have worked for a flex house for quite a few years. You are right. The Polyimide is very dimentionally unstable. (even more so on humid da

Need opinion about KE740 and KE760 !

Electronics Forum | Wed Dec 28 13:04:23 EST 2005 | fastek

Mike- This is sort of how it goes with Zevatech/Juki. 710-chipshooter, 720-Flex mounter 730-chipshooter, 740- Flex mounter 750- chipshooter, 760- Flex mounter (at about this time, Juki took over). So yes....the 730 is compatable with either the 74

MYDATA TM Flex

Electronics Forum | Wed Sep 30 06:25:14 EDT 2015 | strongbyte

I am looking to buy a Flexible magazine for a Mydata TP9-UFP I have seen both TMCFlex and TMDFlex magazines available, does anybody know the difference between the two and whether they are compatible with my machine. I spoke to a Mycronic engineer

Re: Shear strength and Copper/Tin Intermetalic layer

Electronics Forum | Thu Jul 09 21:04:50 EDT 1998 | Dave F

| Hi there, | I am looking for some informations concerning the shear or pull strength of a typical TQFP 20 mils leads in relationship with the Copper/Tin intermetalic layer thickness. Could anyone help? | | Thank in advandce. | rgs, | chiakl Chiakl

Lead Free and Leaded Process Mix

Electronics Forum | Mon Jul 18 13:34:31 EDT 2005 | jzaccari

Francisco, You need to be concerned about "lead-free" BGAs. The SAC balls will not reflow at at standard tin-lead process temps. I have seen many examples where this has been a very big problem. In once case the BGAs just poped-off when the board was

DEK ELA and MPM U2000 Hi-E Comparison

Electronics Forum | Mon Jul 29 09:19:00 EDT 2002 | pjc

Quick Change Tooling is one advantage for DEK when comparing the MPM UP2000. DEK has Form Flex. Good system, but I've heard concerns about long term dependabilty. All support tooling options offered on the UP2000 takes a bit of time to set up. So, If

Mydata (MY12) error-Frame Grab and Light Curtain

Electronics Forum | Wed Sep 23 08:19:52 EDT 2009 | rgduval

Check to see if there's a loose cable, or something, that's randomly setting off the light curtain. We occasionally have that problem with some of our flex or 12/16 mags in our TP9, where the tape take up clip is loose (nothing in that feeder) and i

Re: Cracking Capacitors and Solder Balls

Electronics Forum | Tue Jun 16 15:01:58 EDT 1998 | Gary Simbulan

There are some common reason for capacitor cracking on my web page if you want to have a look. The document can be downloaded for your reference. | Earl, et al, | Boy things get old and cold around here fast. I promised more detail on my capactior


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