Electronics Forum | Sat Mar 08 11:04:47 EST 2003 | Joe
Mark, You've already received some good advice from the other posters. The one thing I would add is that even if you solve your printing issues on this type of part, the relative small quantity of paste may be prone to soldering problems. Ever s
Electronics Forum | Thu May 23 05:38:26 EDT 2019 | je_arrow_tech
We have been having some issues recently with a TSOP-II 54 pin, where upon second reflow the part will lift at end one, most of the time the solder will pull up with it and still connect but I still worry about strain on the component as well as it i
Electronics Forum | Fri Dec 01 00:30:59 EST 2000 | arminski
I have a proto-type PCB with a 48-Pin Fine Pitch TSOP (0.5mm pitch) with a dimension of 19mm L x 11.50mm W x 1.10 Thickness. They are at the bottomside of the PCB and I need to wave solder the board. There are 8 of them at the bottom side. Are they o
Electronics Forum | Wed Jul 19 20:48:05 EDT 2000 | Dave F
Craig: Waving TSOP should be your last choice. You should resist will high levels of red faced, neck vein bulging seriousness. After you loose: * Philips pads are a good starting point. * Recognize you'll probably have to lay-out the pads on the b
Electronics Forum | Fri Jan 08 15:02:38 EST 1999 | Dave F
| HI! I am a package engineer in Korea. I have some reasons | to desolder excessive solder at the lead of TSOP and TSOJ | after removing them from the board. The way with solder wick is too time-consuming and depends on the operator. | Does anyone
Electronics Forum | Thu Jun 25 16:13:05 EDT 1998 | Mike McMonagle
I am looking for a little enlightenment with an issue that we have been seeing. We have SMT assemblies with poor solderability on TSOP and mini-QFP type devices. The solder appears to have incomplete reflow and/or grainyness to the joints. Everything
Electronics Forum | Mon Feb 23 15:10:02 EST 1998 | justin medernach
| Stencil Opening | Looking for spec or any info to specify stencil opening for TSOP48 20mil that will consider also thickens and direction of printing, if applicable Ron, Use a six mil foil thickness for your stencil. Go one to one with your apert
Electronics Forum | Wed Mar 20 11:14:15 EST 2002 | cfraser
Guy's I am sorry but your dike removal process for chip components is midievil at best. The fastest way to remove a chip is with 2 solder irons. Place one iron on each end of the component. This process is completely safe and takes about 2 seconds pe
Electronics Forum | Tue Jul 09 10:15:17 EDT 2002 | msjohnston
Cal, Our parent company is a FAB and they are about to release a new generation of parts. Usually the die is qualified in a simple TSOP form factor. This time the first product quals will take place in the BGA and CSP from factors rather than the t
Electronics Forum | Thu May 06 10:21:09 EDT 2004 | Rob
Let me pose this scenario and ask your opinion. My manufacturing plant is located in New Orleans. Since summer is close upon us, the humidity in my SMT room where the machines and components reside get around 30-50%RH. I've got this Siemens waffle ch
