Electronics Forum | Fri Nov 10 09:13:34 EST 2006 | russ
Dave hit the cons pretty well for type 4 type 4 is used when you have extremely small apertures and type 3 will not fit into them or release adequately basically. I have not yet had application that requires it but got very close once, .007 circle
Electronics Forum | Sat Nov 11 07:54:53 EST 2006 | davef
Many use the following guideline when judging the proper paste for a stencil aperature: You want approximately 5 particles minimum across the smallest aperture.
Electronics Forum | Thu Nov 09 23:01:34 EST 2006 | davef
Tin/lead alloys tend to oxidize very easily, affecting solderability. Use the largest particle sized paste possible, because as the particles decrease in size their total surface area per unit mass increases, effecting: * Demands on the flux increase
Electronics Forum | Mon Apr 13 12:16:59 EDT 1998 | Erhard Hofmann
We have a MPA-80 T and a MPA-40 for sale, but no feeders with the machines. So we are interested in feeders available to complete these machines. Can you please send us informations which type feeders you have available and what the price could be? B
Electronics Forum | Thu Jan 03 14:12:45 EST 2002 | davef
I know fmonette has a MSD audit check list. Maybe when he posts, he'll give us a MSD control procedure aimed at operations types.
Electronics Forum | Thu Jul 22 15:15:24 EDT 2004 | russ
You can purchase pad repair kits at some "radio shack" type stores or you can order them from some such as Circuit repair corp. If you know where the signal traces go from the individual connector pins I woul;d recommend just adding a wire frm the p
Electronics Forum | Thu Jul 19 22:42:04 EDT 2001 | jax
I assume since you talk about adjusting the locking pin and changing tooling you believe the part is not being held down with enough force while being reflowed. Is this because the insufficent and open solder you mentioned is the lead sitting on top
Electronics Forum | Thu Nov 14 00:06:23 EST 2002 | iman
note: retyped due to some earlier technical fault. does anyone know what environment factors(specifications?) and process control parameters(printer & reflow?) are optimal for running SMT using type 4 and type 5 solder paste respectively? Any pitfal
Electronics Forum | Thu Nov 14 09:43:33 EST 2002 | MA/NY DDave
Hi I will only hit only a few and then bug out. Worked with one large EMS place that has the "fail first" approach to engineering and manufacturing. ( I know I know THEY all do). They didn't store the paste as the mfg suggested, they didn't control
Electronics Forum | Fri May 27 09:09:31 EDT 2005 | Rob
Hi Joris, Which package type is it? 1) Melf/quadra melf (CSA) 2) Can type (CSTCC/CSTCR/AVX PBRC) 3) Chip type 3 pad (CSTCE) 4) Chip Type 4 pad (CSTCW) Cheers, Rob.
