Electronics Forum | Wed Aug 02 01:55:34 EDT 2023 | ttheis
The issue ended up being the nozzle changer; Andy from 4tech noticed that the changer was rising unevenly when he measured it in the raised position from the frame rail. He disassembled and cleaned the changer mechanism and the issue was resolved wit
Electronics Forum | Wed Aug 25 07:53:08 EDT 1999 | Scott Davies
| | Could use a little help here. Can anyone clarify to me the cause and fix of chip caps/resistors tombstoning following reflow? | | | | Any help would be appreciated. Thanks. | | | Most common reason is uneven heating where one side of the com
Electronics Forum | Wed Aug 25 09:48:28 EDT 1999 | Larry Koens
| | | Could use a little help here. Can anyone clarify to me the cause and fix of chip caps/resistors tombstoning following reflow? | | | | | | Any help would be appreciated. Thanks. | | | | | Most common reason is uneven heating where one side
Electronics Forum | Sun Dec 08 22:20:39 EST 2002 | grantp
Hi, We have been manufacturing a PCB, however it's been quite tricky to profile, as the edges of the PCB are reflowing before the center of the PCB. I have looked at the design, and there is a small power plane for 2.5 Volt in the center of the PCB
Electronics Forum | Fri Jul 13 08:54:18 EDT 2007 | rgduval
Has your board house reviewed the PCB layer stack? Make sure that the layers are balanced in copper weight, etc? Have you tried pre-baking the boards? We just had an issue with some boards warping that have never warped before for us. It happened
Electronics Forum | Sun Nov 01 23:51:44 EST 2009 | boardhouse
Hi Julie, My opinion is that the top board would not pass IPC, solder mask encroachment on pads. Second board is what we call Orange peel,this can be caused two way's. 1) the solder mask was not tack dried enough prior to imaging which caused artwo
Electronics Forum | Mon Aug 14 14:27:00 EDT 2017 | emeto
Here is some food for thought. Try to answer these questions yourself and I am sure you will see huge improvement. Reasons: - Bad PCB design - Plating-uneven HASL cause more than OSP Au/Ni or Silver - Poor paste and print quality - uneven paste ca
Electronics Forum | Wed Oct 18 09:44:38 EDT 2000 | mike weekes
we're considering PWB finishes other than HASL - the uneven plating contributed to defects and the residues exceed our goal for PWB cleanliness. What success have any of you had with CuOSP, Immersion Silver, Gold or other finishes? Did you have to
Electronics Forum | Mon Dec 09 08:13:06 EST 2002 | MA/NY DDave
Hi Yes it is common to design for more uniform heat transfer during the soldering phase or even during the operation phase. It all depends on how bad the problem is during automated assembly or during usage. The only difficulty is that the designer
Electronics Forum | Tue Dec 17 08:55:52 EST 2002 | Randy Villeneuve
Grant, The board maybe the problem but how is your oven working? Is it a convection oven and how many zones (top and bottom)? What does your profile look like? If you are unsure and if you only have one oven, send your board to Soltec or Electrovert
