Electronics Forum: vacuum handling (Page 4 of 7)

Screen printing warped boards

Electronics Forum | Thu Apr 20 13:55:31 EDT 2006 | cyber_wolf

Here is the problem : We have 2 AP25 printers with dedicated tooling. After we run side one boards through reflow, we get some warpage in our boards occasionally.(Sometimes we get a lot of warp depending on the geometries of the substrate) When the

Re: Moisture Sensitivity and Package Cracking

Electronics Forum | Tue Feb 02 11:07:36 EST 1999 | justin.medernach@flextronics.com

| Greetings, | | We are discussing what should and what should not be baked and vacuum packed. Should we just concentrate on the fine pitch packages and the bga's? | What about those components which come on blister tape, should they get baked and r

Positive Pressure Facility

Electronics Forum | Thu Apr 07 08:02:44 EDT 2005 | Grant

Hi, I used to run a clean room, and it's right, most of the dust is created internally. You will need to add some HEPA filtering to the area, and an air handling unit that can control temp and humidity as well to get correct environmental control.

Re: Handling of Moisture sensitive devices

Electronics Forum | Thu Jan 27 20:34:12 EST 2000 | Dave F

Ashok: The real concern about moisture sensitivity is in plastic packaged parts. The plastic packaging used to manufacture surface mount technology devices absorb moisture from the environment. The high temperatures involved in vapor phase/reflow

Re: humidity in PC packages

Electronics Forum | Mon Jun 21 16:11:41 EDT 1999 | John Thorup

| | I am finding that some of our IC's are coming from the supplier with the humidity gauge in the bag reading 10-20%. Has anybody done any tests to determine what humidty level in a package will cause problems during reflow? | Usually a proper m

Parylene coating - spots defect around via holes & other flat surface

Electronics Forum | Fri Oct 07 08:48:45 EDT 2016 | davef

Two things ... A friend in the contract coating business said: "... the board is not being baked out long enough, 30 min is certainly not long enough depending on how many layers this board is, as the vacuum (from the parylene process) is pulling t

Re: Dusted By Dross

Electronics Forum | Wed May 17 11:19:44 EDT 2000 | John Thorup

Hi Dave It sounds like you do pretty much what we do. A couple of points: If your machine allows, open, fill and seal the dross container inside the machine. Otherwise, the auxillary exhaust as you describe is a must. Be gentle in your movements. Don

Re: Moisture Sensitivity and Package Cracking

Electronics Forum | Mon Feb 01 10:06:51 EST 1999 | Chris Fontaine

All of our moisture sensitive components are shipped to us in vacuum sealed, desiccated bags with a moisture indicator. When the parts are removed from the bag (this is done at either SMT setup, or in the stockroom) the indicator is checked. If it

Very fishy missing solder paste issue

Electronics Forum | Wed Jul 20 14:56:29 EDT 2005 | CLampron

The mount plane is not the same every time. Our machines are conveyorized and the bottom rail is fixed so the mount plane does change with the board thickness. The stand alone table has a V notch for holding the board with the flat edge on the bottom

Re: PCB Support Methods @ the Fuji.

Electronics Forum | Thu Sep 23 06:10:52 EDT 1999 | Wolfgang Busko

| | | Question for you SMT guru's out there. | | | | | | What is the best way to support boards on Fuji's CP6 machine's x-y table...particularly for 2nd side SMT where the support side already has parts... I am toying around with the following meth


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