Electronics Forum | Thu May 30 10:31:03 EDT 2002 | robbied
Hi Yannick. This is an issue that we are just recently getting into but here is some ifo that I have gathered so far. I have seen/ used 2 different rework machines. The one we have bought is a 'PACE TF2000' which was at the lower cost end of the mar
Electronics Forum | Fri Jan 23 10:39:35 EST 2004 | patrickbruneel
Kris, I assume with voids you mean acceptable solder coverage of pad and lead. As Dave mentioned I also have not seen any specific studies on voids, but workman ship standards exist about acceptable coverage of pad and lead (both consumer and MIL)
Electronics Forum | Fri Apr 05 15:24:14 EDT 2019 | sever_83
What can cause solder balls to appear after conformal coating? Using Dymax 9-20557, light curing for 1.5 mins. Can too much heat from light cure cause solder balls?
Electronics Forum | Tue Jan 13 22:07:42 EST 2004 | davef
No, there is no such information. Choices are: * Recognize that any voiding is a process indicator and that when observed, indicate a requirement for taking corrective steps. * Tell your quality people to quit looking at components other than BGA wi
Electronics Forum | Wed Jan 14 08:45:04 EST 2004 | Kris
Thanks Dave Will appreciate if any body has any published information on a study they did for voids in leaded devices Will try to talk to them Dave
Electronics Forum | Mon Jan 19 18:49:42 EST 2004 | menglong
we are facing the same problem,and we are looking for some research result about voids.who can help to provide these ones ? any suggestion, pls keep me informed contact me :zhanglg@tpv.com.cn
Electronics Forum | Mon Dec 22 14:15:41 EST 2008 | ck_the_flip
As Emil says, it's 100% the glue! Your paste is not designed to hold parts on at wave solder. Reflow is MUCH hotter than glue, so I doubt you're not adequately heat-curing it. Possibly, the glue cure is "too hot" and maybe making the material brit
Electronics Forum | Tue Feb 08 16:09:09 EST 2000 | dean
Generally speaking with most electronic grade epoxies: 1. Cure time is a function of temperature. 2. Polymer bonds begin to quickly break down above certain temperatures (product specific). I believe aprox 170-180C. The strength of the bond de
Electronics Forum | Tue Feb 08 14:49:23 EST 2000 | Travis Slaughter
I have never tried this and wouldn�t really even want to consider it. Epoxy generally cures at around 160c in a fairly short amount of time, solder paste requires much more time and a peek temperature of about 210c or more in some cases. Curing you
Electronics Forum | Thu Feb 12 21:30:45 EST 2004 | davef
Comments are: * We're amazed that you can thermocompression bond to epoxy. * Silver may be oxidizing during expoxy cure. * Klein Wassink talks about aging in THE BOOK [Soldering in Electronics: A Comprehensive Treatise on Soldering Technology for Sur