Electronics Forum | Fri Jul 15 12:41:56 EDT 2005 | russ
You are not wrong in monitoring the Product (your really not monitoring the process). This methodology is valuable if your process is unstable (SPC is used to stabilize process). There is value in "real time" inspection of a process's product as lon
Electronics Forum | Tue Jan 06 14:37:27 EST 2009 | stevek
The easiest way to prove out the absorbtion theory is to weigh the parts before wash, after wash, and after baking. You probably want to do this with the bare parts in isolation as the fab will pick up considerable moisture. Differences in weight s
Electronics Forum | Mon Dec 29 09:10:22 EST 2008 | stepheniii
It takes time for the moisture to penetrate into the body. I think the 5 years of ambient would be more the culprit than washing the boards. Especially since you are baking them after wash. Get a few of the ICs and put them loose on a board and put
Electronics Forum | Mon Dec 22 20:16:17 EST 2008 | davef
The first question in solving the "ol' SMT component loss after second-side wave operation" problem is: So, what makes you think the components actually came-off in the wave and not during some previous 'handling'? Putting that aside, we'll play thi
Electronics Forum | Wed Dec 24 11:23:22 EST 2008 | childs
I can't seem to locate any information/concerns about moisture entrapment in IC packages on the promary side in a double sided SMT assembly using water soluable solder paste when soldering the second side. A typical process would assemble/reflow/cle
Electronics Forum | Tue Jan 31 15:40:44 EST 2006 | mgdrouin1
Comp is relay. I've pulled the spec. Max 240. Using Leister h/g with manual temp settings from 1-6 (20 - 600C)set by the operator. Gun was set to setting 4. They are using the heat gun to reflow the solder after SMT but before wave. High fai
Electronics Forum | Mon Dec 22 11:09:21 EST 2008 | mfcat
We changed paste manufacturers rather recently and are now seeing SOT23s falling off after wave solder. These parts have a dual process... we stencil print paste, apply glue, populate then reflow. Only SOT23s fall off, chips are fine. We do not be
Electronics Forum | Fri Jun 19 10:03:46 EDT 1998 | Earl Moon
| Has anyone had experience with placing BGA on gold plated boards. I thought I read a while ago there was a problem with embrittlment causing cracked joints. If anyone has experience with this your feedback would be great. | Mike Mike, We and ind
Electronics Forum | Wed Feb 10 05:23:17 EST 2021 | karl_willoughby
Hello. I am sourcing machines for an SMT line (for the first time) and would like to understand features of current and earlier model SPI and AOI machines. In the intended application, a high volume of PCAs aren't required to be processed but there
Electronics Forum | Tue Aug 09 10:38:45 EDT 2005 | SuMoTe
Water soluable dots will wash off after reflow. A water soluable liquid mask will work as well. dots are better for defined (round)holes, whereas the liquid mask works well with odd shapes.