Electronics Forum: web and developer (Page 4 of 23)

V-scoring design and equipment questions

Electronics Forum | Mon Jun 12 13:10:05 EDT 2006 | muse95

Why do they say to specify the depth of the score, rather than the thickness of the web? How does the scoring equipment work? Is it two blades that you can set the separation distance? Or is it one blade, that you have to run the board through twic

V-scoring design and equipment questions

Electronics Forum | Mon Jun 12 16:33:39 EDT 2006 | muse95

Which spec is that in? I'm seeing web thicknesses of .015 or thinner being suggested for a .062 board, way thinner than 1/2 the board thickness.

MSD in asembly and rework

Electronics Forum | Mon Mar 23 16:20:10 EST 1998 | Robin Arnold

Do you know if there is an IPC standard or industry standard that addresses the proper process for handling MSD's in the production environment....? (rework etc.) Not the receiving area. Thanks so much, Robin Arnold PCB Development Harris Semiconduc

MSD in asembly and rework

Electronics Forum | Mon Mar 23 16:17:39 EST 1998 | Robin Arnold

Do you know if ther is an IPc standard or industry standard that addreese the issues regarding the proper process for handling MSD's in the production environment....? (rework etc.) Not the receiving area. Thanks so much, Robin Arnold PCB Development

PCB material Nelco13 and FR4

Electronics Forum | Fri Jun 25 07:13:40 EDT 2004 | davef

Nelco was developed by Park [ http://www.parknelco.com/parknelco/highspeed.htm ] Without fairly involved testing, you may be forced to rely on a c of c from your fabricator. Although, Park may be able to give you a lead.

Pick and Place Machine Validation

Electronics Forum | Wed Mar 09 12:34:19 EST 2005 | DasonC

You can use Cp and Cpk to find out your machine performance and accuracy. Some machine had it own software and kit. ie. Siemens. If you are using Fuji and you can visit the AD. on this web, TIMEKEY. Otherwise, you can use a high precision AOI with

Heat guns and component damage

Electronics Forum | Tue Jan 31 14:30:38 EST 2006 | Chunks

There is none, since we don't know your part or temp being used. A heat gun CAN be used to remove parts with no damage, if its controled. You need to look up your part on the manufacturers web site, find the process data (time/temp)the part is desi

paste Sn42/Bi58 and Lead Finish

Electronics Forum | Sat Nov 03 11:20:35 EDT 2012 | davef

EricR: There's substantial information about the properties of solder alloys on the web. Here's an example of something that I clipped from one site Alloy ||Solidus (°C)||Liquidus (C°) ||Tensile Strength (psi / MPa) Sn42 Bi58||-E-||138||8000 / 55.2

Merging BoM and XY Data

Electronics Forum | Wed Feb 27 07:38:03 EST 2019 | dontfeedphils

SMT Maestro is the easiest to use by far, unfortunately it seems to have been wiped from the web. Here's a link that should work though... https://drive.google.com/open?id=1Ztj-AUou6oiZiIRkJinBWuaVorWYvP2_

Solder beads and wave soldering

Electronics Forum | Mon Jul 03 05:39:05 EDT 2006 | ronalds

Hi, I am experience problems while testing wave soldering SMT components that are glued on the solderside (lead free). Between de leads of SOx type IC's and SOT's develop a great deal of solder beads. I have been using a RSS temp.profile while spr


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