Electronics Forum | Mon Mar 19 22:09:38 EDT 2012 | davef
J-STD-003B prescribes test methods, defect definitions and illustrations for assessing the solderability of printed board surface conductors, attachment lands, and plated-through holes utilizing either tin/lead or lead-free solders. This standard is
Electronics Forum | Fri Apr 13 22:56:02 EDT 2001 | gdstanton
I've been chipping away on a solder bridging and poor fillet wetting problem for a few weeks now (new to the company) and I found two issues. First, after a review of stencil inventory, I found apertures to be oversized when compared to suggested di
Electronics Forum | Sat Apr 14 03:34:23 EDT 2001 | kpliew
Hi Greg, If u don't mind my recommendations. U may want to try to convince them that by using smaller pad size , u save solder paste in the end of the day (provided u are doing mass volumes). It is another way of getting around to ur idea of changin
Electronics Forum | Wed Oct 28 15:34:45 EST 1998 | carlm
| Can anyone supply me with info on determining the volume of paste left on a pad once reflowed compared to the intial amount put down? Is there a formula or something? | That information should be contained in the technical data sheets supplied by
Electronics Forum | Wed May 08 08:45:29 EDT 2002 | pteerink
I have used the benchmarker for solderpaste evaluations, and had very good results. Best results I had were in evaluating the spread, slump and wetting of the pastes. ( of course that is where I had the biggest issue too ) If you are looking to eval
Electronics Forum | Tue Oct 14 23:30:38 EDT 2003 | Dean
Get high magnifiction micro structure analysis of the failed joints. I bet you will see the correct grain structure. What about the other part types? Any failures? I assume this is standard 63/37 Eutectic solder? These aren't heart monitors or
Electronics Forum | Wed Oct 04 13:58:38 EDT 2006 | cw
hi Dave.F and All, I need to reflow SCA solder balls on Sn/Pb paste, i get a pretty OK solder wetting and collapse apperance, however, i am seeing voids everywhere, some of them is greater than 25-30%, which has exceeded IPC standard. Please advise.
Electronics Forum | Fri Nov 02 09:00:09 EDT 2007 | ck_the_flip
Steve, your best solderer in your shop will know that this ain't standard wire solder. I always put the best solderer on T/C attachment duty when I have a scrap PCB to play with. They even have difficulty getting the stuff to wet to pads and leads.
Electronics Forum | Fri Aug 23 02:29:16 EDT 2019 | sssamw
It seems because the soldering area is not enough, so the wetting force is small to hold the switch, remember >0.08g/mm2 for each part as in IPC standard. So, anyway, you need increase the soldering area to reduce weight/area number to below 0.08g
Electronics Forum | Tue Mar 16 05:11:47 EST 1999 | Charles Stringer
| | AVX and a few other companies make these chip transient voltage suppressors (TVS) parts that are a real *PAIN* to use. According to AVX: | | "Due to the semiconducting nature of the doped Zinc Oxide (ZnO) ceramic material, SMT TransGuard
