Electronics Forum | Tue Jul 06 00:23:11 EDT 2010 | cksam
I am doing the case study of the component chip 0201 tombstoning problem. The significant causes was the reflow profiling preheat slope or ramp up rate. I really can't differential between preheat slope and ramp up rate. Could anyone here show me the
Electronics Forum | Thu Nov 01 22:19:57 EDT 2007 | lvzhu
The solder that we used is kester EM918 and Multicore LS328. Our printer machine is DEK-photon, this machine has supply below 300mm/s. the datasheet solderpaste of speed range is 30 to 150mm/s. when we produce the keyboard of the moble phone, this bo
Electronics Forum | Mon Nov 05 13:33:08 EST 2007 | slthomas
Heck no, I mean we print relatively slower on complex boards, as in 1 inch/sec (25.4mm/sec), and maybe 2 inches/sec. (51mm/sec) on less complex boards. SMT is not a bottleneck in our plant and printing never the bottleneck in SMT, so I see no need t
Electronics Forum | Mon May 30 09:11:15 EDT 2011 | davef
3a ANSI/J-STD-001: * Temperature and Humidity: 18-30°C, 30-70%RH ** If out of range, shall verify electrostatic discharge control program according to ANSI/ESD S20-20 is adequate. ** For process control, more restrictive temperature and humidity lim
Electronics Forum | Mon Nov 05 16:54:00 EST 2007 | bbarton
There are several things that can be done to increase throughput on you screen printer, including the panelization of your bords as Steve & Hussman has pointed out. However that's of limited use if you have plenty of stock that is not panelized. That
Electronics Forum | Thu Mar 02 13:13:14 EST 2006 | Chunks
A ballast is the device needed to energize fluorescent lamps during operation. In all fluorescent lighting systems, the ballast provides the proper voltage to start the lamp and then regulates the electric current flowing through the lamp to stabiliz
Electronics Forum | Sat Nov 17 12:58:12 EST 2007 | mika
I agree with previous postings regarding print speed: Solder paste type/versus fine pitch. Question: Is this a double sided pcb with fairly easy component packages on both sides? In such case, consider make the panel like this: Every second pcb in
Electronics Forum | Fri Jul 31 19:43:43 EDT 2020 | rsatmech
Yes our M/C is having the capability. I will also double check it is enabled in this component. PCB - OSP finish. I will check the component data sheet for your other questions. Thanks for the response.
Electronics Forum | Thu Feb 10 00:42:24 EST 2011 | lenne
nobody can reply me?i just wanna know what is the base material of producing the film.exclude the material,what else should i get to know?
Electronics Forum | Wed Dec 07 00:44:31 EST 2005 | arnold
were having a problem on the units after soldered. after few hours or days the soldered wires has green decay. what does it cause. how can i prevent this.
