Electronics Forum | Thu Jan 12 02:08:47 EST 2006 | adeline_ko
Hi, What is the different between Electroless Nickel / Immersion Gold (ENIG) and Immersion Au. Are they refer to the same finishing? We has been using the Gold thickness (0.00005 - 0.00013mm) , nicket (0.0025mm) for all Gold finishing brd (Immersio
Electronics Forum | Fri Nov 02 07:20:43 EDT 2007 | hussman
Why look at buying expensive equipement when you can have your board house multi-up a panel of boards for you. You just saved at least $150,000 American, didn't have to re-evaluate any solder paste, and even opened your process window on your oven.
Electronics Forum | Sat Nov 17 11:36:16 EST 2007 | etienne
On a Dek Horizon 03 the tact time for one panel measuring 400mm print stroke took me 16 seconds at a speed of 55mm/sec. I see no reason for reducing further tact time since loading and unloading PCBs from Pick & Place machines is relatively close.
Electronics Forum | Tue Jul 06 00:23:11 EDT 2010 | cksam
I am doing the case study of the component chip 0201 tombstoning problem. The significant causes was the reflow profiling preheat slope or ramp up rate. I really can't differential between preheat slope and ramp up rate. Could anyone here show me the
Electronics Forum | Thu Nov 01 22:19:57 EDT 2007 | lvzhu
The solder that we used is kester EM918 and Multicore LS328. Our printer machine is DEK-photon, this machine has supply below 300mm/s. the datasheet solderpaste of speed range is 30 to 150mm/s. when we produce the keyboard of the moble phone, this bo
Electronics Forum | Mon Nov 05 13:33:08 EST 2007 | slthomas
Heck no, I mean we print relatively slower on complex boards, as in 1 inch/sec (25.4mm/sec), and maybe 2 inches/sec. (51mm/sec) on less complex boards. SMT is not a bottleneck in our plant and printing never the bottleneck in SMT, so I see no need t
Electronics Forum | Mon May 30 09:11:15 EDT 2011 | davef
3a ANSI/J-STD-001: * Temperature and Humidity: 18-30°C, 30-70%RH ** If out of range, shall verify electrostatic discharge control program according to ANSI/ESD S20-20 is adequate. ** For process control, more restrictive temperature and humidity lim
Electronics Forum | Mon Nov 05 16:54:00 EST 2007 | bbarton
There are several things that can be done to increase throughput on you screen printer, including the panelization of your bords as Steve & Hussman has pointed out. However that's of limited use if you have plenty of stock that is not panelized. That
Electronics Forum | Thu Mar 02 13:13:14 EST 2006 | Chunks
A ballast is the device needed to energize fluorescent lamps during operation. In all fluorescent lighting systems, the ballast provides the proper voltage to start the lamp and then regulates the electric current flowing through the lamp to stabiliz
Electronics Forum | Thu Jan 12 10:05:13 EST 2006 | davef
There's a lots comparisons like this on the web. Here's one: Westwood Associates said on 8/12/2003: ||HASL||OSP||ENIG||Pd||Tin||Silver Flat||no||yes||yes||yes||yes||yes Solderjoint||Cu-Sn||Cu-Sn||Ni-Sn||Ni-Sn||Cu-Sn||Cu-Sn Contact||E-test, ICT||no|
