Electronics Forum | Fri May 04 02:17:48 EDT 2007 | clusogreg
Are you sure the BGA is not Leadfree and the proces you are using is a leaded process? If so then the Balls will not reflow and there will be cracking. Likewise the other way around
Electronics Forum | Fri May 04 12:18:46 EDT 2007 | ck_the_flip
For the mixed alloy scenario, here's something from the fine SMTNet archives: http://www.smtnet.com//forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=10216&#Message40990
Electronics Forum | Sat May 05 08:00:54 EDT 2007 | davef
Continuing with CF's point on mixed alloy processing of BGA, look here: http://www.aciusa.org/leadfree/LFS_SUMMIT-PDF/09_HILLMAN_Rockwell_Collins_BGA.pdf
Electronics Forum | Tue May 01 06:54:22 EDT 2007 | LC
Hi, We are encountering BGA problems where it dislodge from the board. Some are just by normal handling and some are results from drop test about 15 cm high. We have checked our profile and they are in accordance to the BGA recommended reflow profil
Electronics Forum | Wed May 02 06:28:26 EDT 2007 | LC
In our first run, we actually followed the solder paste recommended profile then we were told to use the BGA recommended one. When we had the 2nd run we still got the same problem. We're using Kester 909HPS (lead free) and ENIG boards. Thanks.
Electronics Forum | Wed May 02 10:45:24 EDT 2007 | bartlozie
I agree with Bob, Do you have a long TAL, ENIG needs a longer TAL then other boards, on the side of this, Latest year there are a lot of bad Au plated boards, we had 3 batch of bad plated boards in the last year. indeed maybe the problem isn't the
Electronics Forum | Thu May 03 09:02:31 EDT 2007 | realchunks
Hi LC, Where are you getting your profile from? Are you actually attaching t-couples to the board? For BGAs the best place to measure is from the center of the device. This means drilling a hole in the board and placing the t-couple thru the hole
Electronics Forum | Tue May 01 07:38:11 EDT 2007 | realchunks
You say the BGA recommended profile? Or did you mean the solder paste recommended profile? I would use the solder paste profile over a parts recommended profile any day. You may need to create a hybrid of the two to get better results. What type
Electronics Forum | Sun Aug 27 20:30:53 EDT 2006 | darby
AJ, We use all ENIG boards. After opening, any remaining boards are kept in low humidity keeping cabinet. I have never experienced a problem using this method I think the longest I have kept them this way is eighteen months. We also store any open tr
Electronics Forum | Thu Aug 24 15:54:13 EDT 2006 | davef
It depends. What is: * Storage environment and period * Board laminate, epoxy, and copper thickness of PTH * Down stream process * Etc FR4 0.062" thick boards absorb between 0.08 to 0.1%Wt of moisture within a 24 hour period, and 0.2 to 0.23%Wt in
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