Electronics Forum | Sun Mar 02 17:40:02 EST 2003 | MA/NY DDave
Hi It sounds like you are in a different country or in the USA a long time ago. I have no idea of the process either is using, so they can be comparable or one can be better than another and lop sided compared to other places. Benchmarking I think
Electronics Forum | Tue Nov 15 21:06:04 EST 2005 | davef
Is your IMC purple? [The sure way to tell if you have the 'purple plague'.] Where does the failure occur? * At pad / wire bond * Up wire from the bond Tell us about the aluminum pad. * What is the plating specification? Is that what you actually r
Electronics Forum | Mon Sep 09 15:38:02 EDT 2013 | arendonk
Hi, We are having issues aluminum wirebonding on ENEPIG plated PCB by a too low pull force and or having lifts (1% range). Could any body advice how to solve this problem? Is there a special wire bond grade required? How to best clean contaminant
Electronics Forum | Mon Sep 09 18:10:35 EDT 2013 | davef
I don't know, but here is a link to a paper from the fine SMTnet Technical Library on a similar topic: http://www.smtnet.com/library/files/upload/Wire-Bonding-and-Soldering-on-Enepig.pdf Contact the authors and ask for their advice and help. BR, d
Electronics Forum | Thu Oct 05 07:23:34 EDT 2006 | Chris
Hi all experts, I have no background about PCB or SMT process. I am now encountering some issues after SMT - Unstable stitch bonding condition. I am now suspecting some contaminants remain on lead after cleaning. Therefore, how can I check th
Electronics Forum | Tue Nov 15 12:21:20 EST 2005 | arclightzero
Well, I can't speak for them falling off later on, as that's not when I see them, and they are passing their wire pull tests after bonding. What I am seeing is electrical opens during testing, and these opens coincide with the Au/Al bonded points. Th
Electronics Forum | Tue Nov 15 09:31:27 EST 2005 | arclightzero
I have been reading a good deal about IMC (purple plague in particular) in gold wire/aluminum pad wire bonds. My company uses ultrasonic wedge bonding, and for the most part all of our bonding is gold/gold, however we have one particulr part that has
Electronics Forum | Fri Oct 06 04:23:06 EDT 2006 | David
What is the solder finish of the board?. If this is gold, maybe you should check the reflow profile and max temperature which can easely kill your gold coating so problems with bonding. Also we are using Prozone Multicore with ultrasonic to clean
Electronics Forum | Thu Oct 05 16:04:00 EDT 2006 | GS
I am not expert, just my comment, the total ionic contamination allowed after SMT, by using No Clean process, theoretically it should be close to Zero. Any way the Standard IPC-JSTD-001 allows 1,56 ugr NaCl/cm2 for the final Printed Board assembled.
Electronics Forum | Tue Nov 07 22:44:39 EST 2017 | wrander1
Hi I'm new to the world of wire bonding. I seem to have some sort of pad contamination Preventing gold wire from bonding to aluminum pats. There appears to be a dozen microns size particles. And a slight crackling of the surface at 500 X. I am send