Electronics Forum | Thu Nov 17 21:46:48 EST 2005 | C. Kolokoy
With DIP type components, a sub-par fluxing method (foaming a no-clean), and a chip wave where one is not needed are formulas for bridging and insufficient wetting. If you have SMD's on the wave solder side of the board greater than 0603, and no SOT
Electronics Forum | Thu Jan 09 19:55:14 EST 2014 | padawanlinuxero
Hello! I have a problem with one of the products here, we use a pallet to run the board on the solder wave, when the board gets solder and you inspect the board you notice that for some reason the first pcbs that touches the wave are ok, even a litt
Electronics Forum | Fri Jan 10 11:36:03 EST 2014 | rgduval
One thing you could check/monitor is the temperature in the pot/wave. As boards run across the wave, they will cause fluctuations in the wave temperature. The heaters should hep with minimizing this; but, if you're running a lot of boards in quick
Electronics Forum | Fri Apr 05 18:22:18 EDT 2013 | Adam
We have two ZipaTec 460s Selective Solder Machines, one for Lead and one for Lead-Free. This morning we noticed the solder pot was covered in solder balls, and after asking the operator what they had run, the answer was "Nothing." The operator had al
Electronics Forum | Thu Jul 10 11:23:36 EDT 2003 | slthomas
I think the guys that write the checks are convinced that it's a service, not a problem. :P
Electronics Forum | Fri Feb 25 09:30:36 EST 2005 | cisridn
Thanks Pete C I will check them out today.
Electronics Forum | Mon Aug 04 13:13:21 EDT 2008 | patrickbruneel
The 2009M is a water based flux and requires more preheating compared to alcohol based fluxes. After checking real chunks advice you might check if you hear sizzling when the solder touches the board (indicator that the water is not eliminated by you
Electronics Forum | Tue Sep 09 16:17:45 EDT 2008 | boardhouse
Logannsan, you may want to check into this a little more with your customer to find out what 2 is. It could be as Vlad say's 2Ag -silver, or it could be 2CU -copper or 2Ni- nickel. Also check this form for 62Sn 36Pb 2Ag just my 2 cent. Regards
Electronics Forum | Fri Jul 08 09:30:35 EDT 2011 | kahrpr
Check that your pick and place machine is not pushing the part too far in the paste and squeezing the paste off the pad. Your profile could need modifying. In the case of the profile the solder paste can slump off the pads before turning into a liqui
Electronics Forum | Thu Jun 29 12:07:09 EDT 2017 | georgetruitt
HOW THICK IS THE BOARD? IS THERE A LOT OF COPPER IN THE BOARD? DOES YOUR CUSTOMERS PROVIDE HEAT RELIEF IN THE BOARDS BARREL DESIGN THERE NEEDS TO BE PLENTY OF ROOM FOR LEADFREE SOLDER TO FLOW, DID YOU CHECK YOUR PIN(LEAD)TO HOLE (BARREL) RATIO? N
