Electronics Forum | Fri Jul 02 09:54:02 EDT 1999 | John Thorup
| | | | We are wave soldering some fabs with a lot of unmasked trace area along the edges. The trace area is solid copper covered with tin / lead, no masking, no components along the edges, same on solder side and component side (goofy board design)
Electronics Forum | Fri Jul 02 10:06:17 EDT 1999 | John Thorup
| | | | We are wave soldering some fabs with a lot of unmasked trace area along the edges. The trace area is solid copper covered with tin / lead, no masking, no components along the edges, same on solder side and component side (goofy board design)
Electronics Forum | Thu May 27 18:10:07 EDT 1999 | Omat Marasigan
hello all, Im working as a process eng'r for BGA package. We are using a water soluble flux for solder ball attachments...so there's still a need for a defluxer machine (using DI water) to clean the BGA strip after reflow. I just want t
Electronics Forum | Thu May 13 21:45:14 EDT 1999 | ardis
I am seeing reflow around my signal pins after being subjected to a profile of 204c for 1 minute and 225c for a min of 30 seconds. Signal pins are soldered into a copper plated alum. case with SB5 and then silver plated. The pins have a hot oil tin
Electronics Forum | Fri May 14 18:34:28 EDT 1999 | Earl Moon
| What is the best way to re-ball a BGA? Who has the best system for doing it? | I'm using our SRT rework stuff to reball in house - when necessary. Of course, we only do this for protos and test boards. We use a standard micro-stencil, after clean
Electronics Forum | Mon May 03 10:08:41 EDT 1999 | Cunli Jia @ SMTnet
| Why don't you publish this in SMTnet papers? I'm sure many would be interested in reading it. You have written many of the papers have written have broad interest. Thanks. Dave F Dave: Thank you for the suggestion. Bob: We would very much lik
Electronics Forum | Thu Apr 22 10:57:20 EDT 1999 | Jack Coia
On various PCB's after building processes,such as reflow, flowsolder and wash. The soldermask on the PCB's have become discoloured, like a 'marble' effect all along the solder side of the board, it is lighter in contrast than normal, although when ot
Electronics Forum | Mon Apr 19 02:49:56 EDT 1999 | Raul N.
25 PPM)! 1. Is there a better process to solder the leads of QFP's with lifted "minute" lifted leads still having a realiable solder joints? 2. Or has anybody tried modifying solder pads and use thicker solder paste deposit to compensate for the ga
Electronics Forum | Wed Apr 14 00:29:28 EDT 1999 | Scott Cook
| Thanks all you kind and knowledgeable folks. I no longer will be participating in this forum. | | After careful consideration, I have come to the conclusion registration, in the manner required to participate in what was an open forum, is not my
Electronics Forum | Tue Mar 16 18:27:34 EST 1999 | Earl Moon
| We are having a small number (~2%) of our boards pass our manufacturing diagnostics, fail once they reach the customer, fail when they get back to us and then start working again after handling them for a short time. We have eliminated a lot of it
