Electronics Forum: (4) (Page 334 of 662)

Solder Wave

Electronics Forum | Thu Aug 11 08:56:20 EDT 2005 | pjc

Some causes of lack of top side fillets (hole fill) are: 1. Not enough pre-heat (a top side preheat will help, if no-clean flux, be sure to follow flux mfrs specification for top side board temp just before hitting wave) 2. Not enough flux 3. Flux i

Brd(Electroylic Gold finishing) got blisters

Electronics Forum | Wed Aug 24 21:57:45 EDT 2005 | adeline_ko

The blistering is around the plugging via. I can forward you the pic. For the plugging process, I'm not too sure how they plug. What is the correct practise for the plugging via. Now, what they did is. They will do a tenting process for both side.

Sell 10 Pair Krone LSA PLUS Disconnection Module

Electronics Forum | Sun Aug 28 22:19:34 EDT 2005 | sonata06

Origin: China Price: To Talk About Specification: 1)Thickness Of Silver Plating:From 2Um-15Um 2)Material:ABS or PBT 3)Cu-Ni-Silver 4)Earth Module,Profile Module,Profile Switching Module,Disconnection Module,Connection Module 5)Different Colors are

Should I panic over .5mm pitch BGA?

Electronics Forum | Wed Aug 31 11:02:28 EDT 2005 | Jason Fullerton

We are using one BGA that has 7 mil bumps on a 20 mil pitch. We use the manufacturer's recommended pad and aperature layout, which is an 11.8 mil square overprint on a 6 mil land. At 11.8 square, you need to use a 4 mil laser cut or a 5 mil e-form st

PCB manufacturer near Quebec, Canada

Electronics Forum | Thu Sep 01 18:27:28 EDT 2005 | Board House

Hi I currently Manufacture product for Dataradio Inc. in Quebec. and would be interested in quoting your product. We are a Multi-layer facility in Minnesota, we currenty manufacture layer counts between 2 & 18 layers. Line widths and Spacing down t

BTU Paragon 150 Reflow Oven

Electronics Forum | Sun Apr 23 09:04:36 EDT 2006 | kanna

Does anyone have any experience with these ovens > ? We are looking at purchasing a used > one. Anything in particular I should look at > when inspecting it ? > > Any comments good or bad > appreciated..... > > Thnx, Sr. i have one problem he

Defect reduction on RF design

Electronics Forum | Tue Sep 20 23:12:38 EDT 2005 | darby

Several suggestions. Your hands may be tied but here goes. 1. Doctor your stencil so that pads are not shared etc and reduce the apertures more that what you would normally. This may stop one pad wetting into another etc. 2. The use of a Pb-free sol

skew components

Electronics Forum | Wed Sep 28 20:54:04 EDT 2005 | Ken

I would run scale calibration first (for the suspect camera). That may be your only problem. However, if your having a rotation issue and all major angles are off (differently) then it is most likely R-axis accuracy. However, I would run AMF and

Solder Volume for Lower Profile PBGA

Electronics Forum | Fri Sep 30 19:14:35 EDT 2005 | DasonC

The stencil is 5 mil thick and the aperture is 12 mil sq. We found open but can't detect by x-ray. The process which we are using is no clean TIN/LEAD. Just thinking the ball size variance from 0.35~0.45mm per IPC-7095, in worst case scenarios, th

Boards Bowing

Electronics Forum | Mon Oct 03 21:15:16 EDT 2005 | adlsmt

Its a single board, one up. 4 layer, pretty simple, no large copper pours. We get these consigned from our customer so I cant work that end of it but wanted to make sure to cover everything I can. The oven it runs in was just checked out by the facto


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