Electronics Forum | Thu Nov 24 21:19:40 EST 2005 | smartasp
Hi, We are also a hig mix low volum plant situated in Sri Lanka and just installed 2 Opals inline from Assembleon with the feeder exchange carts for faster change over. This machines can be upgraded to Topaz by just installing 4 more heads. So far
Electronics Forum | Sun Nov 27 20:47:51 EST 2005 | lerry king
such as : 1, Proof of Design (POD) The DFM/CE Book for Printed Circuit Boards, Assemblies and All Manner of Other Things Technical - by Earl Moon 2, Surface-Mount Technology for PC Boards James Holloman PROMPT Publications July 1995 509 pages 3,
Electronics Forum | Tue Nov 29 22:32:51 EST 2005 | davef
The dissolution rate of nickel into tin is a lot slower than that of copper [into tin]. This results in a nickel-tin (Ni3Sn4) intermetallic that is only 0.25-0.75�m thin after a normal soldering process. The Ni-Sn intermetallic compound tends to be m
Electronics Forum | Wed Dec 14 06:23:47 EST 2005 | tk380514
I almost forgot to ask You: what is the purpose of the BGA inspection microscope? Perhaps we tell You stories that You alraedy know about... the ersascope we have is there to look funny and prove to the customer that we can check if we want to
Electronics Forum | Wed Dec 14 23:32:19 EST 2005 | jhernan9
Hi, I'm having a lot of problems with BGA's shorts, we are using 0.005" stencil aperture 1 to 1 (0.014)", the paste is centre (I can not measured the height)was verified using electronic microscopie, the placement is centre (I'm using local fiducials
Electronics Forum | Thu Dec 15 01:21:42 EST 2005 | bvdb
We own a Fuji IP1 with all the manuals, etc. but can't figure out how to inch the tray robot. We can inch the X, Y, Z, Q axis and the SX and SY axis. All the axis auto zero OK (including the trays), but when I push the "4" key to inch the trays we
Electronics Forum | Fri Dec 16 08:16:41 EST 2005 | davef
Heat cycles deplete the pure tin layer. Each solder cycle reduces the tin thickness by ~0.1 micron (4 uin). So, if you start with a thin imm tin coating you'll have problems after multiple heat cycles. Steve Wentz says, "In almost every case I've
Electronics Forum | Tue Jan 03 03:08:36 EST 2006 | Frank
To answer your compatibity question. I am assuming you have a 730 already... The 760 can always open the 730 files, but depending on the software verion on the 730 the 730 may not be able to open the 740/760 files. If your 730 has version 5 or hig
Electronics Forum | Mon Jan 16 09:15:40 EST 2006 | russ
I can't see why it would be any different, You are melting the balls into reflow to the pad. In my opinion, paste is only useful in this situation to keep the part on the board during placement along with some planarity concerns in some instances.
Electronics Forum | Wed Jan 18 09:06:30 EST 2006 | ronhammer
What I mean by it does not work is after I moved the brackets I have about 4.5 inches from the end of the TWM to the conveyor point. None of our conveyers fit there all our Conveyers have about 6 inches in the front on the conveyer. Is there a differ
