Electronics Forum | Sun Jul 26 07:52:35 EDT 2020 | sync40
Hello to everyone, Have you ever experienced soldermask bubbles inmediately after printed the soldermask itself? (for screen printing method of LPISM). I am not talking here about blistering or any outgassing defects after exposing to high temperatu
Electronics Forum | Sat Jan 25 20:17:40 EST 2003 | ramanandkini
We are soldering a 8 pin TTL chip on to a CEM1 board that has a hot air level soldering. We use no clean soler paste for the reflow process. Now the customer wants us to clean since he is afraid of flux attracting the dust. We have some SMT LEDs that
Electronics Forum | Fri Nov 03 17:36:37 EST 2000 | Thomas Ballhausen
Thank you for your hint. According to the substrate supplier the thickness is less than 1 micron. After Ni/Co layer there is water rinse, then "gold strike", another rinse then "gold plating". But still the total Au layer shall be less than 1 micron
Electronics Forum | Tue Jan 30 02:38:50 EST 2001 | arul2000
This BGA could have gone through the reflow cycle two times as we understand from the BGA manufacturer, during the BGA ball attachment process. (If any ball is found missing, they replace the missed ball manually after applying flux manually and refl
Electronics Forum | Fri Sep 14 02:18:32 EDT 2001 | gsparka
Hi. After reflow soldering. There are lots of non wetting of leads. 71 b'd all are mounted resister,condensor,qfp,plcc,bga have got the defects so many. all defecs occured in the fine pitch ic. others are good. On some fine pitch pads not mou
Electronics Forum | Sun Jun 23 23:23:25 EDT 2002 | beldorian
First question - I am making an assumption that after "de-pop'ing" a BGA prior to socketing the thing to test it, the best known practice is to re-ball the thing. Is this an industry standard? Second question - If it is an industry standard, does a
Electronics Forum | Wed Sep 08 16:21:41 EDT 2004 | rohman23
I'm in a similar situation. We have a pre-historic semi-automatic printer that does a decent job, but would like to get an automatic printer. I've only just begun looking into the different options available, but would like one that could inspect t
Electronics Forum | Wed May 04 13:13:43 EDT 2005 | Jimmie
We have seen the black dot on the BGA pad after the component has been removed from a PCB. When most likely could this corrosion have occurred, while the component was in storage, during manufacturing of the unit? We have a number of these BGA's th
Electronics Forum | Sat Jun 07 04:01:56 EDT 2008 | carmanah
Hi all, Need advice how to fix RJ45 short issue after wave solder m/c .Few actions taken to resolve this issue but the outcome was inclusive which was 1. Modify wave pallet 2. Change conveyor setting from 0.8meter/minute to 0.7 meter/minute 3. Clear
Electronics Forum | Tue Feb 03 03:57:37 EST 2009 | sachu_70
Hi George, I would suggest you to re-look your process parameters, especially for the pre-heat temperatures and the amount of flux deposited. The mask properties and that of your flux also play a role, but you could zero down to the root cause after
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