Electronics Forum | Wed Jan 15 21:55:41 EST 2014 | padawanlinuxero
we do that and there's a variation on the solder temp. sometimes around 10 degrees, we have 2 solder pallets that are run in intervals of roughly 3 1/2 minutes a part (the time that take the operator to put all 3 terminals in a 42 pcbs per board, and
Electronics Forum | Tue Jan 21 13:43:12 EST 2014 | rgduval
Jorge, Your description of the process sounds about right. A fixture to hold the flex cable taut (and in a repeatable location) that allows you to paste/place/reflow is essential. As for notes: Be hyper aware of moisture/humidity in regards to
Electronics Forum | Wed Feb 19 19:20:41 EST 2014 | comatose
That's a pretty vague question, especially if you count "ID" in the time. In a world where you have AOI or in circuit testing telling you which part has to go, limited thermal mass to contend with and decent equipment, I'd say thirty seconds. On my
Electronics Forum | Tue Apr 01 16:14:37 EDT 2014 | emeto
Hello, I have newer generation machine(MV-7) and in my software I can open two programs at the same time. After you do that there is a button in the software saying T/B. when you press this button it will run board1(or top side) and right after you
Electronics Forum | Fri May 09 14:40:38 EDT 2014 | hegemon
I might start with the equivalent 4 or 5 mil stencil and 1:1 on the apertures. If voids are too prevalent, then I would tin the pads of the device, remove the solder, and then solder as above. You may have another hurdle, in that the resulting stan
Electronics Forum | Fri May 23 04:22:39 EDT 2014 | andrzej
Thanks Hege. I've done some research and this might be the root couse: 1. Too thin HAL layer which leads to formation intermetallic Cu-Sn layers on surface after 1-st reflow (most probably) 2. Poor quality of solder for HAL process. 3. Problem
Electronics Forum | Fri May 23 09:27:37 EDT 2014 | emeto
Hello, these pads look so clean.....I am not sure you had a good solder connection there. I would check the following. 1. Is the part RoHS in a lead process 2. X -ray boards after reflow(I assume you will see head in pillow) 3. Check for board con
Electronics Forum | Fri Jul 04 07:11:43 EDT 2014 | padawanlinuxero
Hello We work with a TP9-4 and a MY12 both with tray wagons, I like a lot the tray wagon, for big components we use it, but like AVFM we build our own pallets, and some of them were big 3x30 array or even bigger all pallets were done in a ESD mater
Electronics Forum | Tue Jul 08 10:29:56 EDT 2014 | mleber
We are experiencing FOD coming off of a Cooper Bussman fuse. The components are dark with a metal like substance. In our testing based on what we were seeing we placed components onto a piece of FR4, placed a drop of flux onto the component and ran t
Electronics Forum | Sat Sep 27 13:12:37 EDT 2014 | gascon5383
I have a situation and was hoping to get some opinions on whether a saddle type profile is better or worse than a linear profile. We have an 8 heating zone 3 peak zone and 4 cooling zone single track oven that I am having a tombstone issue with. It's