Electronics Forum: after (Page 372 of 696)

BGA Pad damage

Electronics Forum | Mon Dec 11 06:29:04 EST 2006 | bwet

See before cversus after pics on BGA pad repair here: http://solder.net/services/services_pad-repair.asp The "how to" instructions for traces (and pads) is here: http://solder.net/solderingtips/PadandTrace_Repair_Solder_Tip12.wmv The skill level

Who is responsible for backing up programs on machines?

Electronics Forum | Fri Jan 05 15:10:15 EST 2007 | Bob R.

How about, "Who is the person who'll be called in to spend the weekend getting the machine back up and running after a crash? If it's your home phone number on the maintenance supervisor's speed dial then it's in your best interest to have a back up

Problem with shielding component

Electronics Forum | Fri Jan 12 19:49:07 EST 2007 | stepheniii

I think she might be more on track about the air flow. I would think they not only have thermal mass but also emit thermal energy well which would add to the dificutly of removing them. I think a Dpak would have more local thermal mass than the shie

Wave soldering problem - strange colour of the solder

Electronics Forum | Fri Jan 19 10:43:28 EST 2007 | jimmyjames

You guys are all joking right?! There aren't any contaminates in your solder, the different colors on the surface are completely normal and even expected. The top layer of solder oxidizes and the structure of the surface resembles crystals, refract

GSM Calibration

Electronics Forum | Mon Jan 29 10:12:09 EST 2007 | geb

Hi, I am wondering how often people have their GSM (1994 edition) pick and place machines calibrated. We have had ours installed for about 18 months now. It has not been calibrated since its installation. Head 2 has been picking components off centr

Printing off contact

Electronics Forum | Tue Feb 20 08:19:54 EST 2007 | Steve

One question about the build to print statement; is there some note saying that the vias are to be plugged with mask? If so, I'm wondering when the circle of mask was done over the vias. If it was done as a secondary operation after flood coating, t

Entering placement position on GSM's

Electronics Forum | Mon Feb 12 09:44:47 EST 2007 | SWAG

Enhanced board set-up, set conveyor width, load board, (your fiducials must be accurate!), use two fiducials to set reference point, click on placement(s), move crosshair to centerpoint, use two point teach to teach one point in the center or use cor

Reflow soldering issues

Electronics Forum | Sun Feb 11 23:18:44 EST 2007 | M.Haris

1. If I go to the Pb-free solder paste, is it necessary that I have to change my reflow oven OR just by changing with respect to solder paste specification, I can reach my goal? 2. What is the �Low- Temperature Phase� in any solder paste alloy? 3.W

PCB lamination issues

Electronics Forum | Sun Feb 11 23:32:43 EST 2007 | M.Haris

1. After reflow some boards start producing bumps/bubbles which damage the internal layers causeing PCBs failed in Electrical-testing. How can I eradicate this problem from my assembling process? 2. If SMT components are mounted on non-rigid FLEX PC

CSM84 doorway ?

Electronics Forum | Thu Mar 01 17:34:03 EST 2007 | darby

Before you go any further - what do you want to do with this machine? Search the archives for Yamaha Philips cross reference and there is a bit of info there on what they are capable of. Forget about 0402 and they will only do 0603 capacitors with an


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