Electronics Forum: after (Page 38 of 695)

Small balls on boards after wave soldering.

Electronics Forum | Thu Apr 16 09:33:12 EDT 1998 | Philippe

Is there anybody to help me ? We have small balls appearing on the boards soldered by wave soldering machine and it looks that use of nitrogen is linked to the problem (because without nitrogen, we have no more problems). That remind you something ?

Fine Pitch QFP Bowing after reflow

Electronics Forum | Wed Oct 17 13:51:17 EDT 2001 | Hussman

Moisture has done this to me in the past. Try baking a few QFPs first and then place and reflow. I had to remove them from the tape and reel and place them from a tray - but it was moisture related.

White residue after cleaning with IPA

Electronics Forum | Sun Jan 26 22:28:46 EST 2003 | iman

we had a project like this once. switched to using "genosolve" chemistry (US source, expensive) in conjunction with a degreaser machine, works fine if you can spend the money.

White residue after cleaning with IPA

Electronics Forum | Fri Jan 31 03:39:26 EST 2003 | NP

EC7M is clean up solvent that can help to prevent white residue problem. It made from Orange shield. Good luck

measument of paste thickness after Screen Printing

Electronics Forum | Thu Sep 09 14:41:28 EDT 2004 | Martin

Shark here, reporting for duty.... www.kohyoung.com High speed, 3d 100% paste inspection.

Re-use of SMT Components after Removal

Electronics Forum | Thu Sep 23 16:14:39 EDT 2004 | russ

Control the temp during removal and re-use them. Do not exceed reflow parameters during removal. They should be good up to around 5 reworks. My opinion Russ

Black pad on BGA after removal

Electronics Forum | Thu May 05 11:50:03 EDT 2005 | russ

Just went through this with a customer. Removed BGAs and noticed discolered pads at some locations. It was determined that these were open connections that had some type of flux migration between the ball. They also took solder readily. This may

Black pad on BGA after removal

Electronics Forum | Thu May 05 12:00:16 EDT 2005 | russ

Bad cleaning practice is suspect. It is believed that W.S. flux was used to solder adjacent components and then hand cleaned. This is not definite but it is pretty certain.

Black pad on BGA after removal

Electronics Forum | Thu May 05 12:22:01 EDT 2005 | jimmiem

could there have been a solderablity issue with that pad to begin with, allowing the flux in (from improper cleaning of adjacent work) to expadite an error may have happened later down the road?

Black pad on BGA after removal

Electronics Forum | Thu May 05 15:25:38 EDT 2005 | jimmiem

Would a lesser degree of black pad still allow solderability as i seen in my case?


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