Electronics Forum: stencil (Page 402 of 541)

Re: about solder bridge

Electronics Forum | Thu Apr 06 00:27:42 EDT 2000 | Dean

I would check their data sheet for the particular product. Thats the range I have for Some Kester products I use... Are you seeing any slumping prior to pick-and-place? Is the bridge in the same place every time? How is your pick-and-place mounting

Re: Solder Balls

Electronics Forum | Tue Apr 04 10:08:33 EDT 2000 | Russ

Neil, IPC 610 has the criteria for solder balls re. quantity and size per sq./in. These are acheivable requirements but no-clean is not necessarily a drop in process. You need to review stencil /pad /component design to ensure that "midship" solde

Re: cleaning glue off of stencils

Electronics Forum | Fri Mar 03 16:11:07 EST 2000 | cpitarys

Yes it is Ok and some folks ae doing it now, but unfortunatly IPA may not be the best solvent for this application. Take a small vial of the ipa and put some of your smt adhesive into it, shake it up and watch what happens, now step this up onto a l

Re: Cleaning No-Clean Paste??

Electronics Forum | Wed Feb 23 21:35:01 EST 2000 | Dave F

Larry: You're correct to question this: * We don't like to run raw paste through our aqueous cleaner. It makes a blinking mess. Your entire machine is probably now coated with hazardous material ... well at least the first tank and the out-bound

60 Deg or 45 Deg Blades

Electronics Forum | Thu Mar 15 09:30:01 EST 2001 | keith47611

We've actually seen best results with 60 degree blades (as measured from stencil surface to face of blade), and paste sticking has not been a problem since we switched to a higher quality metal blade. More expensive than the OEM stuff but worth it.

Paste life span on the printer

Electronics Forum | Wed Mar 14 09:07:34 EST 2001 | blnorman

We just ran a study to try to determine this. We exposed the paste to 85% humidity to simulate worst case manufacturing. At various times we removed the paste from the chamber and tested it for tack, solder balling, wetting (copper coupon), and vis

Insufficient Heel Fillets on plastic 240 pin QFPs

Electronics Forum | Thu Mar 22 15:44:50 EST 2001 | pteerink

I have a board with QFP240 plastic package exhibiting the same characteristics. Minimum heel fillet that doesn't change with stencil mods, paste change, profile change etc ( I am working to class 2, though, so my pass spec, although they are not pret

Insufficient Heel Fillets on plastic 240 pin QFPs

Electronics Forum | Thu Mar 22 15:45:20 EST 2001 | pteerink

I have a board with QFP240 plastic package exhibiting the same characteristics. Minimum heel fillet that doesn't change with stencil mods, paste change, profile change etc ( I am working to class 2, though, so mine pass spec, although they are not pr

Solder Paste Volume

Electronics Forum | Thu Mar 29 01:22:57 EST 2001 | chinaman

Hello everybody, Two questions came up during an audit (old topics once more): 1. we are not checking the solder paste volume/pad height after printing - others are using an AOI, but is it really necessary? We just do visual inspection randomly. We

Selective pallet thickness

Electronics Forum | Mon Apr 23 14:59:56 EDT 2001 | relensky

I have been using pallet from Integrated Ideas and Technologies (www.integratedideas.com). They offer a "laminated" pallet that can have the various layers cut in several thicknesses. They are very helpful and willing to solve problems. The best p


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