Electronics Forum | Thu Aug 16 23:30:02 EDT 2001 | fastek
Not exactly sure what your specific requirements are but I am in the process of clearing out a major OEM's SMT facility. Lots and lots of general production equipment is available such as stencil carts, production benches (with and without lights and
Electronics Forum | Thu Jun 08 10:52:37 EDT 2000 | rolandos1
Hello, My name is Rolando and I want to know more about gold fingers protectors. Our current problem is on SMT line which is used with one board with gold pads and while normal production we get solder paste contaminations on these pads, recently o
Electronics Forum | Fri Jun 29 13:54:43 EDT 2001 | Brian W.
I have had some conversations with MPM about the Rheo pump. They have some data to support the change from an ROI standpoint. One of their customers has seen a dramatic decline in the amount of wasted paste, resulting in a very large cost savings.
Electronics Forum | Fri Jun 15 09:16:46 EDT 2001 | adam
Thanks Dave. About your second comment, the issue is placing BGA connectors mirror image (male, and female), the connector sometimes shifts during placement before reflow. we are using a six mil stencil for both sides with minimum paste deposit. a
Electronics Forum | Mon Jun 25 10:06:35 EDT 2001 | dave f
are you saying to put a gap in between the board and the stencil? i have been fighting solder balls for a while now. sometimes i can fix them by placement "z" in the machines other times i can't. what should i have my oven profile look like? i have m
Electronics Forum | Thu Jul 05 07:22:43 EDT 2001 | murray
Dear Herb Intoduce a decent light source (halogen desk lamp or similar)when aligning. Then concentrate on the refection as you adjust in the x & y rather than trying to see edges of pads as they pass the appetures. Start with rapid sweeps to get
Electronics Forum | Mon Jul 16 15:49:33 EDT 2001 | Steve
The solder balls you are talking about are caused by too much paste. Reduce the size of the stencil aperatures. Concerning removing the solder balls, the first thing you need to ask yourself is, do I need to remove them. IPC-610, 12.4.10 states, "Ac
Electronics Forum | Thu Jul 19 08:00:03 EDT 2001 | doctord
Solder balls or mid chip beads? Remember IPC classification for Class 2 allows mid chip beads encapsulated in flux. Usually on R's and C's first thing I would do is verify .006 laser stencil 10% reduction and the most critical, The paste must be on t
Electronics Forum | Thu Jul 12 13:37:18 EDT 2001 | markc
I can't comment on the quality of any vendors equipment, but your question is really a "process approach" issue. What do you expect to find with that 3rd dimensional measurement? 2D inspection should detect the majority of your printing errors.
Electronics Forum | Thu Jul 12 10:18:11 EDT 2001 | Hussman
Ummm...why not use Loctite 7360 Surface Mount Adhesive Cleaner? It's designed to remove adhesive and works great. Low oder and can be bought in 500ml cans for hand cleaning. Part# 25658. Use it why any dry wipe. Do not use alcohol to clean this