Electronics Forum | Thu May 29 10:42:40 EDT 2003 | swagner
So is it fair to say that on a moisture laden double sided flex circuit you could see an increase in tombstoning on the 2nd pass due to warpage created by delamination? In other words a 0603 for instance could tombstone due to the delaminated surfac
Electronics Forum | Mon Aug 11 11:06:16 EDT 2003 | davef
Se�or Tech: Consider searching the fine SMTnet Archives, while you await other responses. There was an idential thread in what seems the past six months. Time passes as blur. So, it could have longer than that. As I recall, you should be consi
Electronics Forum | Thu Sep 04 16:44:19 EDT 2003 | mleber
We are a military contractor running mixed technology CCA's. We currently "map" all defects off reflow and wave by indicating the defect on a map (plot from gerber) then passing it on to rework. The map is used for SPC data as well as overall perform
Electronics Forum | Fri Dec 19 08:47:47 EST 2003 | browning
I recently found a company that will take the Gerber data and create full Documentation and machine programs from Gerber. The cost is extremely reasonable, so much so, that I have been having them do all of our work. I cannot even do the work myself
Electronics Forum | Mon Jan 05 00:30:07 EST 2004 | Arthur Yang
Hi you there, Do you have any experience upon the shelf life of PCBA which passed 100 cycles of liquid to liquid thermal stress test, 125 to -35 centigrade for 15 minutes and 5 seconds of transfer time from 125 to -35 centigarde. Will apprecia
Electronics Forum | Tue Mar 09 03:52:56 EST 2004 | vantott
what you have provided are the settings on the oven and not the temperature profile (which represents the actual temperature experienced by the cards as they pass thru the chambers). Usually, solder paste manufacturers provide recommended specs for
Electronics Forum | Wed Apr 07 10:10:00 EDT 2004 | ccl
thanks Dave, solder mask use is AUS 5 from Taiyo ink, solderability of the contam area is still pass the min spec. gold thickness is ~ 1 um and Ni layer is ~10um. can solder mask bleed cause contam? forget to tell the product is full body gold (FBG)
Electronics Forum | Tue Jun 01 19:19:24 EDT 2004 | Ken
single is for a single model. In other words, your "fiducials" are identical or near-so. Multi means your using multiple models. The machine will use individual models for alignment. I would use multi on pads. Is this an SPM machine? I bet your
Electronics Forum | Thu Jul 15 07:08:29 EDT 2004 | pcbrown
Basically, it's a tilting problem of certain devices. Usually with axial by-pass caps tilting, which pulls the lead up through it's mounting hole. Other problems with components with leads cut to lenght to eliminate post-wave trimming. All suggestion
Electronics Forum | Mon Jul 19 08:55:54 EDT 2004 | dwanzek
Thanks, good input. The joints do seem to wet well, they pass solderability test we have done. The defect is apparent right after reflow, before wave solder. No we do not profiled with the oven loaded..... good idea. We run an ovenrider each shift an