Electronics Forum: stencil (Page 409 of 540)

Re: That is good advice. (End)

Electronics Forum | Mon Jul 20 19:31:00 EDT 1998 | Eric

:On a dense board, a great way to reduce solderballing is to either; print paste 1:1 with pad size using a 5mil foil, reduce aperture openings by 10% of pad size or change aperture shape to "Home Plate" design. If none of these work on their ow

$.02 on DEK 265 GSX PRINTER

Electronics Forum | Thu Jul 16 12:50:36 EDT 1998 | smd

200 boards an hour and probably does. Our slow P&P machine keeps us from getting that benefit. But we get to have all the headaches. I think the printer runs on a 286! That's pretty sorry for such an expensive piece of equipment. The stencil frame is

Re: Placement of 0201'

Electronics Forum | Tue Jul 14 10:24:33 EDT 1998 | JMCoogan

Wayne We (Universal Instruments) started demonstrating the placement of 0201 chips at the last Productronica show in Germany. But at this point in time, you will be hard pressed to find anyone using it in production (although the placement equipment

Re: Solder Paste Evaluation

Electronics Forum | Thu Jul 09 17:05:22 EDT 1998 | Dave F

I am looking for some guidelines on evaluating solder paste. I am specifically interested in No-Clean Pastes, as they are a completely new ball game when it comes to slump, tack time, stencil life, tack time, etc. Thanks for any and all help give

Using solder paste/reflow for leaded thru hole parts .

Electronics Forum | Wed Jul 01 11:33:30 EDT 1998 | Upinder Singh

Hi all. I am trying to put one 20 pin thru hole connector along with the smt components on the PCB. I would appreciate if somebody can guide me in getting thru this process. I also need to know how much bigger the holes on the screen or stencil shou

Re: email address change

Electronics Forum | Mon Jun 15 17:49:51 EDT 1998 | Earl Moon

I knew there was something or one missing around here. Welcome back. Anything, interesting, earth shaking, or revolutionary East of the "Big Muddy?" I often forget I'm there too. Earl Not much, just watching Create KME place 0201's sort

Re: Bottom side smt and thru hole

Electronics Forum | Sun Jun 07 09:43:11 EDT 1998 | Bob Willis

There are some guidlines on design and through hole reflow on my web site to download. Also on pin in hole reflow the SMTA Office has a document on using the tecnology. R&D is currently designing a board with smt components on both sides of the bo

Re: Bottom side smt and thru hole

Electronics Forum | Wed May 27 10:19:43 EDT 1998 | Jerry

We have no problems but orientation does matter. Orient with longest side of component body perpendicuar to wave. In other words the same preference as with through hole DIPS. Idea is the same as for through hole, that the surface tension will ten

Re: Quick Frame and Dek 265GS

Electronics Forum | Wed May 20 12:01:16 EDT 1998 | Chrys

Have you tried the new Accu-Frame from PNC? It tensions on all four sides using an operator-INdependent mechanical scheme. It seems pretty slick. They're failry new, and don't have a frame for the MPM's last time I checked, so I haven't tried it m

Re: Quick Frame and Dek 265GS

Electronics Forum | Wed May 20 10:00:00 EDT 1998 | EFData

The quick frame does work well with the DEK 265, but we feel that tensioning is user dependent and introduces variation into the process on an operator to operator basis. Also, because tensioning occurs only on two sides (instead of four) this also i


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