Electronics Forum: (4) (Page 410 of 662)

Re: Qualifying new PWB Vendors

Electronics Forum | Sat Jan 16 02:43:21 EST 1999 | Earl Moon

| Hello, | | We are qualifying new sources of PWB vendors. We've got the first lot of "produciton" boards in and we want to put them through the paces before turing the vendors on. | | So far, the tests I can think of performing, and that we have

Re: smt reliability vs thru hole

Electronics Forum | Tue Jan 18 12:36:11 EST 2000 | Dave F

Dave: I haven't located something to support your contention, yet, and I'm not going to comment on the factors that drive reliability beyond component selection, because I know that you've got some sweaty-palmed sales type wringing his hands waiting

Re: Missing SMT Chip Components

Electronics Forum | Wed Sep 15 03:11:33 EDT 1999 | Charles Stringer

| | | Hi, | | | | | | Recently encountered missing components problem at the SMT process. | | | Among 13 chip components from the same part number mounted on the board, only 4 ( located in a same row and next to each other) were missing after post r

Re: Air-Vac stuff

Electronics Forum | Fri Aug 20 13:00:16 EDT 1999 | ScottM

| I'm trying a second time to post this very important message, to me, concerning Air-Vac's following creation. Does any own and use this stuff successfully to remove solder from 20 layer and up MLB's with .020" diameter holes? Also, is any of the ad

Re: Micro-BGA soldering

Electronics Forum | Tue Jul 27 16:44:31 EDT 1999 | Earl Moon

| | | Presently protos of micro-bgas (80i/o) pitch .030/.031 | | | 12BGA per assembly | | | | | | The board is a (.062, 4 layers) FR-4 using Dry film | | | Pads .014inch | | | Vias within footprint .020inch | | | Vias to be filled by bottom side(sol

Re: Micro-BGA soldering

Electronics Forum | Tue Jul 27 17:23:45 EDT 1999 | M.L

| | | | Presently protos of micro-bgas (80i/o) pitch .030/.031 | | | | 12BGA per assembly | | | | | | | | The board is a (.062, 4 layers) FR-4 using Dry film | | | | Pads .014inch | | | | Vias within footprint .020inch | | | | Vias to be filled by b

Re: FR4 vs Polyamide

Electronics Forum | Mon Feb 15 15:33:47 EST 1999 | Earl Moon

| Any info on the pros and cons of FR4 or Polyamide ref the use of soldering PGAs would be helpful. ie. temp co-efficient diffs, baking, wave soldering, Convection reflow etc | I'm sure you know all the basic differences as Tg, X, Y, and Z expansi

Re: Batch Cleaners

Electronics Forum | Tue Dec 08 18:40:04 EST 1998 | Graham Naisbitt

Hi all, Only observation I would make is that it depends upon what you term as clean? Now isn't that an old thorny question. Care to comment? Regards Graham | Hey there Dave! | | We used to use a batch cleaner when we used water-clean paste.

Re: Batch Cleaners

Electronics Forum | Wed Dec 09 12:48:50 EST 1998 | Mike Konrad

First, let me say that I am a manufacturer of batch cleaning systems. The following information is not intended to be a commercial for our cleaners, but rather a commentary about batch cleaners in general. Batch cleaners come in all sizes and confi

Re: Questions regarding rework

Electronics Forum | Tue Dec 08 17:55:51 EST 1998 | Dave F

1. What is the best way to remove polyurethane conformal coating from selected areas? Your conformal coat material supplier is best equipped to tell you how to remove the coating. Polyurethane conformal coating is not easy to remove. Without in-pu


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