Electronics Forum | Mon Jul 07 13:33:40 EDT 2008 | realchunks
Most QFP 128s have a 0.16mm wide lead. Might have to modify your pads if you'r buying some odd ball part. But generally 0.2mm should be OK for this part. You may never get good toe wetting. Most QFPs are cut apart after plating, thus the toes are
Electronics Forum | Tue Oct 02 10:30:10 EDT 2012 | eniac
Difference in pick height from paper and embossed reel (typically) is 0.2 mm. Try to change your pick height and place height (different type of capacitors have a different height: for 100 nF 0603 and for 4.7 uF 0603 it's a big difference!). Can you
Electronics Forum | Wed Mar 18 22:52:15 EDT 2015 | mdang
What nozzle size do you use to place 01005 on Fuji CP8 machine? The smallest nozzle size on the CP8 is 0.4mm. Could we use this nozzle to place 01005 since the size of 01005 pacakge is 0.4mm x 0.2mm. Thank you for your help, -Michael
Electronics Forum | Fri Jan 31 10:04:14 EST 2020 | emeto
Jinesh, My initial suggestion is you have too much solder past. Please try to reflow a few of these parts without solder paste. Colse aperture, put some tacky flux on this part location and give it a try. I bet you will not see any voiding.
Electronics Forum | Wed May 05 05:41:02 EDT 2021 | jineshjpr
Hi All, Need your suggestions on the below queries: 1. What will happen if the Au thickness maintained @ 0.5 to 1 micron (Where Ni Thick is within 3 to 5 microns) in 0.2mm Thickness FR4 PCB. 2. Is there any solder quality affcted during Reflow Solder
Electronics Forum | Fri Dec 22 16:28:07 EST 2023 | jeana
I've tried yesterday, I've spray painted a XF nozzle with mat black paint. (with some protection on the tip obviously). It is not really succesful though, Vision still have false detection. When a part is indeed on the tip, it detects it but with
Electronics Forum | Mon Aug 16 13:38:35 EDT 2010 | rl
i would like to request some advice on manually dispensing paste for super fine pitch components. first some background. i am a small design house and specialize in sub-miniature prototypes for avionics. so far, i have mostly used stainless steel st
Electronics Forum | Tue Feb 20 07:31:45 EST 2001 | Nick L
0.076 ~ 0.2 um(micron) but our substrate gold thickness is between 0.3~1.2um. Is there any related to the plating process of substrate! And how can they control this thickness?(May be I should ask substrate vendor their controlling limit). If this i
Electronics Forum | Tue Sep 26 20:19:51 EDT 2000 | Dave F
Never heard of N-Tech. Whose material do they use? Two common materials are: Imidazole (Via Systems) and Entek (Enthone) OSP is a lacquer that fabs apply to boards by either spraying or dipping. What thickness control does your fab use? For inst
Electronics Forum | Sun Feb 10 16:35:06 EST 2008 | neocera
Hi, I have a PCB with a blown PMIC (power management integrated circuit) multi voltage regulator IC. The PCB is rather rare and I need to replace the PMIC, its footprint is 7mm X 7mm with 12 solder points per side. Unfortunately I can only solder th
