Electronics Forum: after (Page 42 of 696)

Blow hole on pad after reflow oven

Electronics Forum | Fri Jan 21 13:27:38 EST 2011 | mosborne1

Try baking your boards first to remove the moisture. Moisture and boards that have not been drilled properly will cause pin hole or blow holes in PTH. Also take a look the surface of the pads before printing. You maybe contaminating the surfaces of t

Blow hole on pad after reflow oven

Electronics Forum | Sun Jan 23 17:26:48 EST 2011 | piter

Hi In my experience try to change component to another batch or anther manufacturer it is very often problem in reflow when components have strange finish

Tant Cap fell down after SMT

Electronics Forum | Thu Apr 07 10:33:23 EDT 2011 | markhoch

The Part Data sheet should specify whether or not the part can withstand the Wave Solder. (I've wave soldered many Tant Caps)It sounds like you need a higher volume of SMD Adhesive. How are you applying the adhesive?

Black color solder wetting after reflow

Electronics Forum | Fri Apr 29 08:28:17 EDT 2011 | markhoch

Is it possibly being caused by surface contaminants on your PCB? Or possibly flux residue? Is this a one time occurance, or are you seeing it regularly? Is it happening in other areas on your PCB or in just this location? Can you please provide more

baking out pcbs after reflow process

Electronics Forum | Wed Jul 11 22:48:54 EDT 2012 | joeion

It is correct to remove moisture in PCB by baking. But I think the time and temperature is too little. According to our experience, it should be more than 60min at 120 centigrade degrees.

PCB Silk Screen changing Color after Reflow

Electronics Forum | Sun Nov 16 19:05:45 EST 2014 | warwolf

Seen it. We use a lead free process, sometimes our supplier will use a lead process silk screen that burns at a lower temp. The HASL coat was still SN100CL.

Gold Finger Edge Connector Bevelling after process

Electronics Forum | Sun Apr 12 18:16:28 EDT 2015 | davef

Beveling machine: * Seetrax Bevcut [ http://www.seetrax.com/edge_finishers.htm ] * Radoll Design Bevel Master

Gold Finger Edge Connector Bevelling after process

Electronics Forum | Wed Aug 19 03:58:47 EDT 2015 | pcbman

hello , friend, it is better to finish the bevel process before assembly,you can send me the pcb gerber file I'll check for you the best panlization.

caps have yellow stain after wash

Electronics Forum | Tue Jun 07 21:10:53 EDT 2016 | deanm

The first thing I would do is give Alpha a call and talk to their tech support about it.

BGA Top Cap Detached after reflow Soldering

Electronics Forum | Sun Jun 12 09:29:41 EDT 2016 | davef

I'd guess that the interconnect pads on the BGA have poor solderability. Confirm this with testing at an independent lab. Work with your supplier to resolve the issue.


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