Electronics Forum | Thu Apr 13 11:38:53 EDT 2000 | Kevin Facinelli
Couple more questions: The problem we have is that on the bottom side we are using a bunch of resistor networks. These have been very difficult to solder through the wave. The products: Top Side: 4-6 BGA 2/3 QFP 500 component
Electronics Forum | Thu Feb 08 09:07:22 EST 2001 | Hussman
OK, without knowing the specifics, why does everyone blame the oven? Most solder balls occur around R's and C's in almost every shop I've been to. The best place to start looking is the screen printer - not the oven. Sure the oven is the last proc
Electronics Forum | Mon Feb 19 13:31:25 EST 2001 | billschreiber
Hello Mark, EPA Certification can be a tremendous help to the user that is evaluating new cleaning processes. Let�s face it, if it wasn�t for the Earth�s ozone layer, everyone would still be using CFCs and a vapor degreaser to clean stencils, PCBs
Electronics Forum | Mon Feb 19 12:43:16 EST 2001 | billschreiber
I�m going to reference Mr. Clouthier�s article again. It seems that the information contained within his article is answering many of the questions that are being asked. I highly recommend that everyone reads it. A copy can be found at the followi
Electronics Forum | Wed Mar 14 17:52:49 EST 2001 | davef
6 Work Life Test 6.1 Obtain a stencil with 15 to 20 rows of a series of 0.025 by 0.050 inch apertures spaced 0.050, 0.040, 0.025, 0.015, 0.010, 0.010, 0.025, 0.040, 0.050 inches apart. See Appendix 1. Source of supply: Metal Etching Technology.
Electronics Forum | Wed Jun 27 21:24:47 EDT 2001 | davef
Welcome. First, proper alignment can produce an order-of-magnitude increase in the number of boards that can be printed without wiping. The initial alignment can be made either by: * Peering through the stencil apertures at the board underneath and
Electronics Forum | Thu Jul 12 10:32:59 EDT 2001 | Hussman
Wow, what a string of answers and nobody brought up the easiest way to eliminate solder balls. Yes, the paste being squished under the part does reflow and work it's way out to the side during reflow. I did a 5 week study on this (when I was a bori
Electronics Forum | Mon Jan 31 13:34:43 EST 2000 | PAUL WOOD
HELLO CUSTOMERS OF OK LATEST INFORMATION UPDATE WITH REFERENCE TO OLD BGA 2000 MACHINES WHICH ARE NOW 6YEARS OLD MANY NEW INVENTIONS WHICH HAVE TAKEN PLACE CAN BE PURCHASED FROM METCAL TO BRING YOU TO THE FOREFRONT OF TECHNOLOGY.(PATENTED TO ) BGA 30
Electronics Forum | Mon Dec 06 17:50:39 EST 1999 | Kantesh Doss
Christopher: Thank you for sharing your experience about the DPAK. Yes, out part has a heat sink at the bottom. Our stencil opening was 7 mils (in both X and Y) smaller than the pad size excepting that the stencil opening consisted of a series of zeb
Electronics Forum | Fri Nov 26 09:13:10 EST 1999 | Wolfgang Busko
Jeff, Ted, Stefano What Stefano is saying sounds reasonable. With entry-level systems its always a struggle to get sufficient results. The operators golden hand is needed. Better controlled advanced dispensing systems should do the work, unluckily I
