Electronics Forum | Thu Nov 11 14:13:57 EST 1999 | Dave F
Thomas: From what you're telling us, you seem to be thinking correctly: 1 Paste should not spread appreciably in preheat 2 Something has changed, because you've not had this problem, until recently Two things to consider: 1 Has any thing changed
Electronics Forum | Sun Nov 07 10:54:21 EST 1999 | Steve Thomas
We're looking at redesigning our stencils to facilitate better (well, it's pretty much non-existant, so any improvement is a big leap) release from fine pitch apertures. Currently we have perpendicular walled laser cut apertures. We'll be having
Electronics Forum | Tue Nov 09 19:45:48 EST 1999 | Steve Thomas
1 Money IS an object, and my boss will be thrilled. The stencil manufacturer recommended ovals to facilitate better release. Seems likely to be true, but whether or not it's necessary I don't know. We have perpendicular walls on these (6 mil) ste
Electronics Forum | Tue Sep 21 17:49:50 EDT 1999 | John Thorup
| | | | I like to see if anyone has any info or experinces with metal inspection templates in a post oven process. | | | | My problem issue is the ESD, since they are metal(12 mil stencil material). I welcome any comment. | | | | | | | | Thank you.
Electronics Forum | Tue Sep 21 17:56:59 EDT 1999 | John Thorup
| | | | | I like to see if anyone has any info or experinces with metal inspection templates in a post oven process. | | | | | My problem issue is the ESD, since they are metal(12 mil stencil material). I welcome any comment. | | | | | | | | | | Tha
Electronics Forum | Wed Sep 22 17:21:45 EDT 1999 | Hugh Martin
| | | | | | I like to see if anyone has any info or experinces with metal inspection templates in a post oven process. | | | | | | My problem issue is the ESD, since they are metal(12 mil stencil material). I welcome any comment. | | | | | | | | | |
Electronics Forum | Tue Sep 21 13:12:56 EDT 1999 | Dave F
| My stencil thickness is 6 mil and we got qfp's with fine pitch. | how many percent should i reduce my stencil aperture using a 6 mil stencil for 0.5 mm pitch and 0.4 mm pitch ? | | thanks | Greg: I was going to link you to the IPC land pattern c
Electronics Forum | Tue Sep 07 06:29:19 EDT 1999 | Earl Moon
| We are changing over to a No-Clean paste soon and l was wondering how other people tackle the issue of stencil and PCB cleaning in high-volume production. | | The paste we are using is Cobar 325RX and its pretty sticky stuff let me tell you! | |
Electronics Forum | Tue Sep 07 20:21:31 EDT 1999 | armin
| | We are changing over to a No-Clean paste soon and l was wondering how other people tackle the issue of stencil and PCB cleaning in high-volume production. | | | | The paste we are using is Cobar 325RX and its pretty sticky stuff let me tell you!
Electronics Forum | Thu Aug 26 14:45:09 EDT 1999 | Earl Moon
| What are the key steps to achieving high yield with CSP ??? | | (We are trying qualify vendors for volume fab/assembly of some | products which use several CSP devices on each side of the | board. (Some with 0.5mm ball pitch)) | | Looking throu
