Electronics Forum | Thu Jun 14 02:00:01 EDT 2001 | ianchan
Hi mate, AOI seems great for : 1) missing 2) wrong parts 3) wrong orientation 4) x-y axis misalignment 5) upside down placement 6) etc.....? AOI shucks for : 7) unsolder (joint) defect 8) tombstone / tilt My guys are evaluating AOI m/c, for substi
Electronics Forum | Wed Jun 13 21:25:48 EDT 2001 | dougk
We've tried the MPM rheo., with excellent results. We saw a decrease in fine-pitch pad coverage rejects from ~20% to bacicially ~0%. Print speeds went from 1-2 in/sec (metal blade) to 4-5 in/sec (rheo.). Could probably go faster. Great throughput. Li
Electronics Forum | Mon Jun 18 10:14:30 EDT 2001 | surachai
HI ALL; I WOULD LIKE TO KNOW THAT ANYBODY CAN RUN GLUE PRINTING PROCESS WITH 0402 CHIP AND PASS THEM TO WAVE SOLDERING PROCESS ,PLEASE GIVE ME THE INFORMATION ABOUT THEM . 1)HOW WIDE OF APERTURE DO YOU OPEN ON YOUR STENCIL? 2)HOW MANY YIELD OF THIS P
Electronics Forum | Tue Jun 26 22:52:27 EDT 2001 | ianchan
I second that juicy bit from brownsj, Sn96/Ag4 process is what we are using too, currently for BIB runs, dunno about current capital investments needs, coz from what I understand, our company's BIB pioneer guy, personally designed the machines in cur
Electronics Forum | Tue Jun 26 12:24:24 EDT 2001 | nifhail
Thanx for the reply Dave. We actually had a few thermocouples attached from underneath to see if there is any delta in temperature within the same BGA's ball. They looks OK, with the slope of 1 -2 Deg C,soak at 120 Deg C - 150 Deg C at about 90 sec,
Electronics Forum | Wed Jul 11 12:26:54 EDT 2001 | mzaboogie
Hi Ian, Answers to your questions: 1) PCB Pad Finishing- HASL 63/37 2)Checked a sample lot of parts. Coplanarity did not seem to be an issue. Some of the parts checked still exibited this condition after reflow. 3) There are no large ground plane
Electronics Forum | Fri Jun 29 14:15:00 EDT 2001 | stefo
This is a question about complying with J-STD-001 solderability testing. Do any of you have your vendors certify that the components and PCB's that you buy from them comply with the solderabilty requirements spelled out in the -002 and -003, in lieu
Electronics Forum | Sat Jun 30 04:43:09 EDT 2001 | brendan
Hello We introduced OSP finish on some of our products but now need to add some discretes at the end of the process. From my little knowledge of OSP, this is difficult. We'll SMT the boards and transfer them to another site for further processing.
Electronics Forum | Thu Jul 19 22:42:04 EDT 2001 | jax
I assume since you talk about adjusting the locking pin and changing tooling you believe the part is not being held down with enough force while being reflowed. Is this because the insufficent and open solder you mentioned is the lead sitting on top
Electronics Forum | Wed Jul 18 11:19:58 EDT 2001 | genny
I didn't wade thru all of the info you presented above, but your comment about ampacity of printed circuit boards brought to mind a copy of an article I keep in my files. Luckily I photocopied the whole page from the magazine and can actually tell y