Electronics Forum | Tue Sep 24 11:10:07 EDT 2002 | Gregg Temkin
I�d appreciate assistance in trying to resolve a placement/soldering problem. My company has designed a board which uses a large number of 0402 LED�s that are .028� high. The LED�s need to be soldered so that they point straight up and are not til
Electronics Forum | Thu Oct 17 17:18:48 EDT 2002 | Leandro G. Barajas
Hi everybody, This is a simple posting to initiate a discussion on different ways to troubleshoot, improve, and control the Stencil Printing Process SPP in SMT manufacturing. There are many SPC, ANOVA and other analysis techniques that provide insi
Electronics Forum | Mon Mar 03 14:09:59 EST 2003 | Bill Schreiber
Hello Alwil, It appears that some of the other respondents are recommending that the waste stream be discharged to drain, if possible. Keep in mind, the chemistry used is not the only factor to determine legal drain disposal. If you are cleaning s
Electronics Forum | Thu Dec 08 14:26:58 EST 2005 | chunks
Start with your board first. Do you have resist/mask between the fine pitch? Is the finish HASL or a flat surface? If there is no mask/resist between the fine pitch leads you may want to reduce the apertures 5%. If the board is HASL, that means yo
Electronics Forum | Mon Jan 09 13:11:07 EST 2006 | Joe
I assume you're using a no clean Pb/Sn paste, with a metal squeegee. Here are some generic procedures for good printing results for all pastes. Clean and dry the stencil well using alcohol and vigorously rubbing it with lint free towels, blow it off
Electronics Forum | Sat Mar 18 02:21:31 EST 2006 | pavel_murtishev
Good morning, Once again a met annoying solder beading issue while producing board with PLL (leadless, contacts from the bottom side of the package). Board has very high placement density and beads appear near PLL package only. This package is finep
Electronics Forum | Tue Mar 28 08:29:04 EST 2006 | davef
Pad design - Standard IPC 20 pitch QFP Thermal pad design - Layout the thermal pad 0mm to 0.15mm larger per side (0mm to 0.30mm larger overall) than the exposed die pad on the package. �Larger than�, as opposed to the same size, is preferred. Obvio
Electronics Forum | Sun Mar 26 19:02:05 EST 2006 | ms
Hi We are running automatic stencil printers, open squeegees, stainless stencil, stainless blades, print speed 25-30mm/sec. We have a frustrating consistency issue printing .37x.3mm apertures on a 45pin LGA (11 pads each side, 1 large ground in mid
Electronics Forum | Tue May 09 22:57:58 EDT 2006 | davef
The NexLev connector is built in a stripline construction, providing a continuous ground plane for each signal contact. The connectors come as tenrow connectors with 100, 200, or 300 positions at possible stacking heights from 10 mm to 30 mm. Technic
Electronics Forum | Tue Oct 31 13:15:13 EST 2006 | realchunks
SWAG is prolly right. You can verify the tactile sensor by watching the machine carefully. When finding the stencil height, make sure the board goes all the way up and touches the stencil to trigger the tactile. If it doesn't, then something is wr
