Electronics Forum: stencil (Page 422 of 541)

Lead Free Choices

Electronics Forum | Tue Jul 12 20:19:22 EDT 2005 | Tom

Don't mind Sam Adam's and Asahi beer... I'll send you a tantelising pint of Guinness, cool and with a fresh creamy head if you can help me with the following.... What do I do about lead free stencil design? Is there a guideline anywhere? Most lead fr

Lead Free Stencil Design

Electronics Forum | Wed Jul 13 15:26:32 EDT 2005 | russ

The problems we saw had to due with the Flux I believe. We saw what I would call poor coelescence and the residues were very hard for us to clean with our Water only cleaner. I will not lie and say I worked on the process very much. Since we alrea

Solder Paste Storage

Electronics Forum | Sun Jul 17 23:45:04 EDT 2005 | adlsmt

Without knowing how much you use or what you use it for or what brand and which type, hard to say. In general, follow the Manufacturers recomendations. If you are doing precision work then use cartridges and let them warm up to room temp for a few ho

Stencil Cleaning / Zestron / Vigon

Electronics Forum | Thu Aug 25 13:06:45 EDT 2005 | carln

I evaluated a couple of the Vigon products by Zestron last year and I think the SC200 was one of them. They seemed to clean OK, and Zestron said they were biodegradable, but they conveniently failed to disclose that they contained VOCs. If you are

Hirose Connector Installation........

Electronics Forum | Wed Aug 24 22:53:34 EDT 2005 | mrduckmann2000

We have a customer that is using the new Hirose connector p/n df30fc-40dp-0.4v. The connector has lead spacing of .4mm. I beleive that if I have a stencil cut to 2-3 mil I should have enough solder paste to solder the connector to the PCB pads. Ho

Should I panic over .5mm pitch BGA?

Electronics Forum | Wed Aug 31 00:50:59 EDT 2005 | grantp

Hi, We have a new part we need to mount, and it's a .5 mm pitch BGA with .3 mm diameter pads. That's a lot smaller than we have done before, and we currently use 1 mm pitch BGA's with .5 pads. Has anyone does .5 mm pitch BGA's and what needs to be

Should I panic over .5mm pitch BGA?

Electronics Forum | Wed Aug 31 09:06:11 EDT 2005 | PWH

Agree with Siverts. We do a build that has 0.3mm pad diamter BGA (0.8mm pitch - distance from pad center to pad center) and 0.5mm dia. BGA balls. Stencil specs. are: 5 mil. thickness, square BGA pad aps. (1:1, 0.3mm square aps), laser cut. Seems

Should I panic over .5mm pitch BGA?

Electronics Forum | Wed Aug 31 11:02:28 EDT 2005 | Jason Fullerton

We are using one BGA that has 7 mil bumps on a 20 mil pitch. We use the manufacturer's recommended pad and aperature layout, which is an 11.8 mil square overprint on a 6 mil land. At 11.8 square, you need to use a 4 mil laser cut or a 5 mil e-form st

Using Glue on Stencils What aperatures to use?

Electronics Forum | Mon Sep 19 08:36:53 EDT 2005 | lloyd

I had a similar problem a few years ago when glue printing. Our production environment wasn't to clean room standards and there was a bit of air born contamination floating around which would gather on the PCB surface (also our rough board edges wou

Defect reduction on RF design

Electronics Forum | Tue Sep 20 23:12:38 EDT 2005 | darby

Several suggestions. Your hands may be tied but here goes. 1. Doctor your stencil so that pads are not shared etc and reduce the apertures more that what you would normally. This may stop one pad wetting into another etc. 2. The use of a Pb-free sol

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