Electronics Forum: stencil (Page 423 of 540)

Solder Volume for Lower Profile PBGA

Electronics Forum | Fri Sep 30 19:14:35 EDT 2005 | DasonC

The stencil is 5 mil thick and the aperture is 12 mil sq. We found open but can't detect by x-ray. The process which we are using is no clean TIN/LEAD. Just thinking the ball size variance from 0.35~0.45mm per IPC-7095, in worst case scenarios, th

Manual Stencil Cleaning Solvent

Electronics Forum | Fri Oct 07 16:39:19 EDT 2005 | pjc

Here are some: Mfr. Model Flash Point Tel Nr. Kyzen Ionox 13400 170 F +1-615-831-0888 Zestron SD 300 106 F +1-703-589-1198 Zestron VD 143 F Zestron

This looks very interesting (Mydata Jet Solder Printer)

Electronics Forum | Fri Oct 14 15:44:30 EDT 2005 | fastek

Yes....interesting. Word is this better be successful for them or they are done. At first glance my issue would be what impact do solder paste "dots" have in the following areas compared to stenciled paste: 1) Controllable with regards to volume 2

Need Help for CCGA Rework

Electronics Forum | Mon Oct 31 19:03:49 EST 2005 | myu

We need to rework for CCGA1657 (Ceramic Column Grid Array): removal and soldering. Its size: 42.5 x 42.5 mm. Its height is 7.25 - 9.61 mm. We use 63Tin-37Lead water-soluble paste. Our mini-stencil is 6-mil with 27 mil apertures. Please show your expe

Moisture absorption in the solder paste

Electronics Forum | Wed Nov 09 02:24:49 EST 2005 | laxman

Hi Dave, Normally in our country (India) during rainy season the temperature will be 25to 30 �C and RH of 50 to 60%. The reason behind this humidity issue is that recently we have moved to our new facility with centralised air conditioner with Chill

USING LEAD FREE PARTS WITH LEAD PASTE

Electronics Forum | Sun Dec 11 20:23:52 EST 2005 | grantp

Hi, As far as I know soldering a lead free BGA in a lead process is similar to soldering down some BGA's such as ceramic that had high temp solder balls. Remember back when a lot of BGA's had hi temp solder balls that also did not collapse during re

CSM 84V: damaged parts (mmelf, 0805) during placing.

Electronics Forum | Tue Dec 06 18:29:45 EST 2005 | darby

You may also wish to check the speed controllers for both descent and ascent. The higher the ascent speed the more force the jaws close with. It can be difficult to achieve a "good" nozzle placement height as this is mechanically set and your lowest

BGA short

Electronics Forum | Wed Dec 14 23:32:19 EST 2005 | jhernan9

Hi, I'm having a lot of problems with BGA's shorts, we are using 0.005" stencil aperture 1 to 1 (0.014)", the paste is centre (I can not measured the height)was verified using electronic microscopie, the placement is centre (I'm using local fiducials

BGA short

Electronics Forum | Thu Dec 15 11:06:05 EST 2005 | Samir Nagaheenanajar

You might wanna try a small reduction in your stencil aperture. For example, for a 30-mil pad go 26-mil square aperture with 8 to 10-mil radius on your corners. Also, look at your designs. Is there enough resist between your pad and ball? Another

poor print definition

Electronics Forum | Tue Feb 21 09:19:50 EST 2006 | Chunks

Hi Mark, Not to be condescending, but is your 265 camera in focus? I've seen one instance of this. If it�s not the camera, and you are sure all your other parameters are good, , then poor definition can be from bad snap-off or bad gasketing. Snap


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