Electronics Forum | Mon Apr 30 06:44:34 EDT 2007 | dszeto
Is there any benchmarking / report available on the industry regarding to the application of leadfree solder Sn(99%)/Ag(0.3%)/Cu(0.7%) e.g. Alpha Metals SACX0307 compared to SAC305? Thanks! Daniel
Electronics Forum | Wed Dec 26 14:21:47 EST 2007 | gersla
I am looking for suggestion of BGA 0.5mm pitch Ball 0.3mm (BGA 8x8mm)assembly and soldering. Stencil thickness? Stencil reduce? Etc.
Electronics Forum | Thu Jan 03 08:02:53 EST 2002 | davef
Slump is a function of the particular paste you select and the temperature of the paste. Use a slump test like the one that follows to compare fluxes. Slump Test Step Process activity 1 Print paste on white ceramic substrate or microscope sli
Electronics Forum | Mon Mar 25 23:11:44 EST 2002 | ianchan
Thank You, Dave F!
Electronics Forum | Thu Mar 10 08:46:08 EST 2005 | jdengler
Rob, Try http://www.alphametals.com Jerry
Electronics Forum | Fri Apr 22 10:52:35 EDT 2005 | patrickbruneel
Ken Which flux are you using
Electronics Forum | Thu Dec 15 08:20:39 EST 2005 | jhernan9
The BGA pitch is 0.8 mm and stencil thickness is 0.005"
Electronics Forum | Thu Mar 02 17:46:22 EST 2006 | Chris
Go with no greater than 0.005". Pleanty of paste and minimal shorting issues. 0.004" will even work
Electronics Forum | Tue Sep 19 15:11:16 EDT 2006 | d0min0
Hi there, we use inertec els 3.0 and 4.0 machines regards
Electronics Forum | Thu Dec 27 11:05:40 EST 2007 | realchunks
5 or 6 mil thicjk stencil and no reduction.
