Electronics Forum | Fri Feb 11 02:42:17 EST 2005 | marakas
Thank you very much for your answer. We had: 1- 224 pins, size 19*19 mm, pitch 0.8 mm 4- 48 pins, size 11*7 mm, pitch 0.75 mm 1- 160 pins, size 15*15 mm, pitch 1 mm 1- 196 pins, size 15*15 mm, pitch 1 mm How many defects I should expect with th
Electronics Forum | Fri Dec 16 04:41:30 EST 2005 | tk380514
A day and half is a life time for our solder paste, Almit V14L... but then we dont have in-line solder paste printers, we have micro BGA stencil that wont work with anything but new solder paste, 0.8mm pitch and pad size is 0.3mm, stencil thickness
Electronics Forum | Mon Feb 21 17:56:44 EST 2005 | davef
You want approximately 5 particles minimum across the smallest aperture. So in the case of a 0.8mm device, we use .017" pads with a round 0.020" aperture on a 6 thou thick stencil foils. Here, 0.020" diameter equals 0.50mm. This gives us 0.50/5=10
Electronics Forum | Thu Jun 13 11:25:40 EDT 2002 | davef
Help us understand your situation by telling us about: * Is this a terminal-to-terminal short on a single MELF? Or is this a terminal-to-terminal short between or than one MELF? * Clearance of 0.8mm is the distance between what features? * Size ME
Electronics Forum | Wed Jun 04 13:05:31 EDT 2003 | JoeH
I may have the oppurtunity to purchase a AAT Microjet machine with the Mach II drying capability. I like the theoretical cleaning/drying capability and power consumption advantages this machine could give us. The relative small footprint is also a
Electronics Forum | Wed Sep 08 06:22:51 EDT 2004 | Tore
Hi all, There seems to be a problem with the major component vendors/manufacturer everywhere; to supply lead free dummy/daisy chain components, in particular BGA-devices, within a reasonable time (not a big fan of 8-12 weeks). If they got them at all
Electronics Forum | Sat Jul 29 07:17:34 EDT 2006 | Ali Uzel
Hi all, I do know a little on PCB manufacturing. I would like to know whether using gold on PCB pads can cause soldering problems, both using automation and by hand. We are using a new device, 484-pin, 0.8mm, BGA and 0402 size capacitors. Or it can
Electronics Forum | Sat Dec 14 02:29:52 EST 2013 | padawanlinuxero
Hello I hope this helps For a component with axial leaded - vertical The clearance of the component body or weld bead above the land is 1.00mm (0.039in) Component body must be perpendicular to the board The overall height does not exceed maxim
Electronics Forum | Sun Feb 13 19:04:13 EST 2000 | Jackie Hsieh
First I'm a Taiwanese people so excuse my bad english writing. On my experience, The process of double side SMT procedure with two methods ---First one is appling the glue on the solder side, and placeing the R,C,L chips components on it.and 2nd one
Electronics Forum | Fri Oct 16 21:07:31 EDT 1998 | Scott McKee
| I need the following information on uBGA's - body size, ball pitch and ball diameter. Are they a plastic package (with the resulting moisture sensitivity of a PBGA)? Also, does the uBGA put any special requirements on pick and place equipment? |
