Electronics Forum | Tue Apr 24 21:00:58 EDT 2018 | marlonbc
Hi All, Would just like to course through this concern on a product that we are contracted to assemble. It is mainly used for an automatic hand sanitizer dispensing product. By design there is a restrictive value of current that it needs to dissipat
Electronics Forum | Wed Oct 07 15:46:36 EDT 2020 | tamasmagyar
Hi Hearse, I currently use a MY600, with a AG Ejector which can place dots between 0.33 and 0.52 mm. The differences for a MY600 with placing small dots is down to ejector and paste. To be able to place dots as small as 0.25 mm, you would need an
Electronics Forum | Mon Oct 25 15:45:11 EDT 1999 | Dave F
Joe: Lemme see, you�re talking about controlling your manufacturing process within 4.6 defects per 100 opportunities or a 4,600 dpmo rate, a cumulative 99.95 acceptance rate, or a �2 sigma process, right? So, it�s fairly basic stuff, eh? First, yo
Electronics Forum | Mon Apr 26 15:04:14 EDT 2004 | pjc
You are correct in understanding that the vision system comes into play for subsequent boards- to align them. Yes- if you missalign the first board and set the cameras to that board, all subsequet boards will not be aligned. Mylar is a thin polyester
Electronics Forum | Mon Jul 18 12:25:30 EDT 2016 | oleksz
Some people involved in PCB assembly process claim that SMD components reflow soldering problems are often caused by traces running under a component. According to this claim, trace (or any copper) covered by solder mask and placed under SMD componen
Electronics Forum | Wed Jan 13 04:27:00 EST 2016 | crystalpcb
Hi Here is our factory production capability: Shenze Electronic PCB Specification Layer Count 1 to 35 Layers Material Brand Shengyi,KB,GRACE,ISOLA,Rogers,Taconic,ARLLON,Bergquist Base Material FR-4（TG135,TG150,TG170,TG180），Halogen Free FR-4，Ceramic
Electronics Forum | Tue Mar 28 08:29:04 EST 2006 | davef
Pad design - Standard IPC 20 pitch QFP Thermal pad design - Layout the thermal pad 0mm to 0.15mm larger per side (0mm to 0.30mm larger overall) than the exposed die pad on the package. �Larger than�, as opposed to the same size, is preferred. Obvio
Electronics Forum | Tue Apr 17 13:33:00 EDT 2001 | Kris W
Howdy all! Nothin' up my sleeve!!! While attempting to reflow an RF antennae on std FR4, HASL coated, using no clean paste, in a Research Thermaflo 10, the part sometimes slides on one of the pads (as much as 0.125"). There is a slight amount of w
Electronics Forum | Mon Oct 15 10:51:49 EDT 2001 | davef
On over printing, the general issues are: * Paste deposits being so large that when reflowing, collapse onto many, rather than a single solder mass. * Paste expanding during heating and being close to other solder deposits and bridging [as you say].
Electronics Forum | Wed Mar 29 03:40:06 EST 2006 | Frank
The Juki 2060 can have both front and rear trolleys and you do not loose any feeder locations. My question was why can't the Assembleon put trolley on the rear? I recently visited a friend at a company that used a lot of Assembleon and compared run
