Electronics Forum: 016 (Page 5 of 7)

Re: Micro Vias in Pads

Electronics Forum | Wed Mar 25 19:41:01 EST 1998 | Earl Moon

| We have successfully put .016" vias in .030" pads. | There is no drain off with .030" solder balls, since | the actual volume in the .002" depression is low. | We did notice random bubbles where, apparently, the | solder reflowed and trapped the a

0402 tombstoning

Electronics Forum | Thu Apr 11 14:31:15 EDT 2002 | aaelect

We're having some problems with 0402's tombstoning. On a board with about 300 parts we're getting about 12 to 20 tombstones per board. The caps seem to do it more often than the res. The pads appear to be in accordance with IPC SM 782 amendment 1, S

Solder Paste and fine pitch components

Electronics Forum | Wed Sep 18 18:41:17 EDT 2002 | davef

People have made good comments. Additional points are: * Your bridging is probably being caused by one or more of the following: [1] printing too much paste, [2] smearing the paste during placement or subsequent handling, or [3] paste slump during t

Step-up stencil: recommendation thickness

Electronics Forum | Mon May 20 12:01:37 EDT 2019 | gregoireg

I have a PCBA job which has on the top side a few standard QFN components (0.4mm pitch) and a big module (35mmx60mm) with 1.13mm BGA pads: https://imgur.com/a/YUGgejW To be clear, this module is composed of a PCB with some components on top and some

Re: placement of 8 ml smt components

Electronics Forum | Thu Sep 10 15:29:15 EDT 1998 | matthew park

Tim, What is it? Which ones are you talking about: 0.080" vs 0.008", 0.100" vs 0.010", or 0.050" vs 0.005" pitch devices . If you are saying 0.080",0.100" and 0.050", any pick and place machine can handle that. Well if not, one machine that is ca

Re: BGA PAd Soldermask

Electronics Forum | Wed Feb 16 21:51:29 EST 2000 | Dave F

Kurt: Lots of choices, not many of them good, yano. 1 So LPI has taken over the market pretty nearly 100%, but it won't "tent" reliably, because it is not very viscous when applied and drops into the hole. So then, tenting/plugging with LPI is bad

Re: BGA PAd Soldermask

Electronics Forum | Wed Feb 16 21:51:29 EST 2000 | Dave F

Kurt: Lots of choices, not many of them good, yano. 1 So LPI has taken over the market pretty nearly 100%, but it won't "tent" reliably, because it is not very viscous when applied and drops into the hole. So then, tenting/plugging with LPI is bad

Re: Component Packaging Trends

Electronics Forum | Thu Oct 15 17:14:50 EDT 1998 | Justin Medernach

| Hi Folks, | As I travel our industry it seems to me the trend is to move from finner and finner pitch QFP's to array packages (BGA's, CSP's, etc.). Do you folks see the same trend? What is the finest pitch QFP package you have used in your process?

Re: Starting an SMT line

Electronics Forum | Tue Sep 08 13:33:07 EDT 1998 | Brad Kendall

For pick and place, I have worked with the Zevatech machines and Philips machines. Both are great machines. The Zevatech will give you greater speed and still offer great accuracy and repeatability. Don't let the belt drive stuff scare you, it sta

Samsung CP20CV

Electronics Forum | Thu Jun 01 16:46:40 EDT 2023 | assuredtech

We have the following Samsung CP20 spare parts and feeders available, we also have CP40 - CP45 spare parts and feeders available - please inquire. 1.) Fine Suntronix MRK OR4-H Power Supply 24V 16 Amp Output 2.) Y Axis Service AmplifierSanyo Denki PY0


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