Electronics Forum | Fri Oct 04 11:25:49 EDT 2002 | Bob Willis
If you want some additional material on 0201 design and assembly the SMART Group Committee produced one of its Charity Reports with all the money raised going to the Red Cross USA September 11th Appeal. You can get it from the SMTA Main office, it fe
Electronics Forum | Wed Sep 21 15:49:45 EDT 2022 | markhoch
I agree. The silkscreen will cause a gasketing issue with the stencil.
Electronics Forum | Mon Dec 18 21:17:41 EST 2006 | davef
Use the IPC calculator [free at http://www.ipc.org]
Electronics Forum | Thu Dec 14 22:28:38 EST 2006 | Tony
Hi, where can I find info about how to make the pad design to work for VSSOP48 0.4 mm Pitch & TSSOP56 0.5 mm pitch components? I should also mention that we are working in a project that this 14 layers High-Frequency RoHS board is included. The pad c
Electronics Forum | Mon Oct 17 11:16:09 EDT 2005 | slthomas
There are a lot of things that might affect your cleaning efficiency. Paste type (no clean or w/s?), cleaning chemistry, aperture aspect ratio (aperture width/stencil thickness), "linty" wipes, etc. Another thing you need to look at is the frequency
Electronics Forum | Mon Sep 17 09:33:10 EDT 2001 | markt
What are the challenges associated with stencil printing for 0201 applications and what process settings are recommended?
Electronics Forum | Fri Oct 14 19:41:06 EDT 2005 | KT
We encounter this kind of issue. We use stencil clean in the stencil printer and also use air to blow aperture after cleaning. We are having some luck !!
Electronics Forum | Fri Oct 14 14:09:19 EDT 2005 | bschreiber
Your problem is not the 0.4 pitch. Your problem is the manual cleaning. Manual cleaning will only remove the solder paste from the surface of the stencil. What's more, manual cleaning will force additional contamination into the 0.4 pitch apertures
Electronics Forum | Fri Oct 21 14:13:08 EDT 2005 | mafc65
1.- Clean bottom and top stencil with a cloth/alcohol at same time.Pay special attention to fine pitch locations. 2.- Clean again bottom stencil side .To prevent any residual of solder 3.- Blow air with a air gun under the stencil to remove the solde
Electronics Forum | Tue Jan 04 11:25:34 EST 2000 | Brian E. Steelglove
John, I work for Panasonic Create and I just got back from Japan where we sat through a presentation on pad layout and stencil layout on the 0201. Please give me your fax number and I will send it right over. Sorry I do not have it on disk. Bria
